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0 Shore A Waterproof Liquid Silicone Gel 2 Components Transparent Gel Silicone for PCB Junction box electrical insulating gel Product Description: HN-6607AB is a very soft, low crosslinking density addition sil...
Ultra-Soft Two-Component Silicone Gel for IGBT Module Encapsulation HN-6607A/B (product series) is a very soft, low-crosslink-density two-component addition-cure silicone gel supplied as a 1:1 (A:B) liquid syst...
DESCRIPTION SLF385 silicone 1 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are throughly mixed, the mixture cures to a flexible elastomer, which is well suited for th...
STC07 Series surface mount toroidal coils and common mode toroidal choke,SMD Common mode inductor,pad size 16.5*17.5mm FEATURES: · Inductance: 1mH to 39mH · Rated current: 0.3A to 2A · Higher Frequency · High S...
Product Description: One of the key benefits of this product is its low water absorption rate. With a water absorption rate of just 0.10-0.20% by weight after 23℃×10days, this epoxy resin is highly resistant to...
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Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:70-90℃。 Formulatio...
Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:70-90℃。 Formulatio...
Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:80-100℃。 Formulati...
Production details: Epoxy resin LE-8516 100 pbw Formulation Hardener LH-8516 100 pbw Filler Silica Flour 300-350 pbw Color paste LC series * 3 pbw LE-8516 is a modified saturated epoxy resin system. LH-8516 is ...
Product Description Bi-component alicyclic saturated structure epoxy resin system /liquid can be used to the processes of APG& Conventional casting process under vacuum,Excellent UV resistance &heat shock resis...
Product Description Property Bi-component Epoxy resin system/Liquid can be used to processes of APG&Conventional casting process under vacuum.Excellent splitting resistance&heat resistance TG:90-110. Epoxy resi...
Product details Product Description Property Bi-component Epoxy resin system/Liquid can be used to processes of Conventional casting process under vacuum. Excellent splitting resistance& heat resistance TG:100-...
Liquid Epoxy Resin and Hardener for Electric Insulators(casting process) Property Bi-component Epoxy resin system/Liquid can be used to processes of Conventional casting process under vacuum. Excellent splittin...
High Thermal Conductivity Encapsulating Low Viscosity heat conducting material With Silicon For OBC Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Compo...
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sl...
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sl...
1.0 W/m.K Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey Vi...
White Thermally Conductive Silicone Encapsulant Usage Temperature -40℃ ~ 150 ℃ Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Grey Vi...