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...RF Module BGM13S22F512GA-V3R SMD Bluetooth Modules Product Description: Silicon Labs BGM13S Blue Gecko BLUETOOTH® Mesh SiP Modules offer a turnkey BLUETOOTH 5 system in a compact System-in-Package (SiP) form...
...5g 1560-1620MHz 50W GaN Module Customized Portable RF Power Amplifier Module with RS485 Communication for Anti Uav Specification 1.The power amplifier uses domestic core key components and can operate normal...
Portable RF Power Amplifier Module with RS485 Communication for Anti Uav Specification 1.The power amplifier uses domestic core key components and can operate normally at low temperatures of -40C. 2.This docum...
.... Board level shielding can complexity without cost With chemical etching there is no limit to profile complexity or aperture array. We can incorporate bend lines so components can be formed by hand,...
.... Here we present the generic specification for the 100GHz-32ch Athermal AWG Optical Module C-Band in Passive DWDM System MUX/DEMUX component supplied for use in DWDM system. Athermal AWG (AAWG) have equival...
... ◆ Three-port isolation() ◆ 3000VDC isolation voltage between input, output and power supply ◆ Operation requires no external power supply, no external components ◆ 4 ~ 20mA input/4 ~ 20mA output ◆ Industria...
...passive loop-powered moduleSelection Example: Example: Signal input 4-20mA , Signal output 4-20mA Model: JSD MI 4-20mA-F Two-wire 4-20mA passive loop-powered moduleFeatures: ◆low cost, small size, SIP12 pack...
...passive isolation amplifier moduleSelection example: example1: signal input:4~20mA;signal output:4~20mA;model NO:JSD MI 4-20mA Two-wire 4~20mA passive isolation amplifier module Features: ◆ low cost, small s...
...Component Index, file number E54214 ♦ Glass passivated chip junctions ♦ High surge overload rating-50 amperes peak ♦ Ideal for printed circuit boards ♦ High temperature soldering guaranteed: 260°C/10 seconds...
... Peak Ideal for Printed Circuit Board Applications Plastic Material - UL Flammability Classification 94V-0 UL Listed Under Recognized Component Index, File Number E94661 Mechanical Data Case: Molded Plastic ...
... MIL-S-19500 • Meets MSL level 1, per J-STD-020, LF maximum peak of 250 °C • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and...
... transducers technology. It composed by 15"+1.75", RMS power is 450W. CD15 Features: 1. CD 15 Componented by 1pc 15" high quaity comppression driver units with 1pcs 1.75" compression driver units. It is clea...