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Product Features: Double component, condensation type. Room temperature curing. Ethyl alcohol released after curing, non-corrosive to electronic components High adhesion to all electronic components e...
7580 polyurethane hot melt adhesive for Mobile phone Product Features: 7580 reactive polyurethane hot melt adhesive is a kind of solid content of one component reactive hot melt adhesive 100%. Peel strength wit...
...Potting Compound For Electronics Glue Adhesive 1:1 2 Parts Heat Conductive Potting PRODUCT DESCRIPTION of Heat Conductive Potting Glue HN-8806, two-component addition type silicone potting rubber which can b...
DESCRIPTION SLF385 silicone 1 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are throughly mixed, the mixture cures to a flexible elastomer, which is well suited for th...
STC07 Series surface mount toroidal coils and common mode toroidal choke,SMD Common mode inductor,pad size 16.5*17.5mm FEATURES: Inductance: 1mH to 39mH Rated current: 0.3A to 2A Higher Frequency High S...
Liquid Epoxy Resin(Casting process)and Casting Hardener for Insulators Product Description Liquid, Hot-curing cast resin system for electrical insulation material for medium and high voltage applications. Epoxy...
Wholesale APG molds with electrical insulation epoxy resin for EMBEDDED POLES Product TDS: JT 8259A Epoxy Resin 100 pbw JT 8259B Epoxy Hardener 80 pbw Wholesale APG molds with electrical insulation epoxy resin ...
Casting Process Mould Release Agent For APG Mold With Dry Type Transformers MOULD RELEASE FOR TRANSFORMER, CT PT Product Description: JT 6101 Organic Silicon Mould Release agent Features: Good release effect hi...
Medium High Voltage Transformer Flame Retardant Epoxy Resin 68928-70-1 TDS: JT 8600A Epoxy Resin 100 pbw JT 8600B Epoxy Hardener 80 pbw Liquid, Latent, Silica flour filled, hot-curing cast resin system. Special...
Liquid Flame Retardant Epoxy Resin For Medium High Voltage Insulation Switch Parts Product Description Bi-component Epoxy resin system/Liquid can be used to processes of Conventional casting process under vacuu...
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Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:70-90 Formulatio...
Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:70-90 Formulatio...
Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:80-100 Formulati...
Production details: Epoxy resin LE-8516 100 pbw Formulation Hardener LH-8516 100 pbw Filler Silica Flour 300-350 pbw Color paste LC series * 3 pbw LE-8516 is a modified saturated epoxy resin system. LH-8516 is ...
Product Description Bi-component alicyclic saturated structure epoxy resin system /liquid can be used to the processes of APG& Conventional casting process under vacuum,Excellent UV resistance &heat shock resis...
Product Description Property Bi-component Epoxy resin system/Liquid can be used to processes of APG&Conventional casting process under vacuum.Excellent splitting resistance&heat resistance TG:90-110. Epoxy resi...
Product details Product Description Property Bi-component Epoxy resin system/Liquid can be used to processes of Conventional casting process under vacuum. Excellent splitting resistance& heat resistance TG:100-...
...Potting Material for electronic components Two-component addition type Waterproof Silicone Potting Compound Grey Low Viscosity 1:1 Silicone PRODUCT DESCRIPTION HN-8806, two-component addition type silicone p...
Electronic Potting Silicone 10:1 RTV Potting Liquid Silicone Gel For Electronics Led Light Driver Clear Silicone Product Overview for Silicone Potting Compound: This potting compound is a liquid silicone rubber...