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This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers can be removed for uncut material and defective products. Market uses are as ...
silicon carbide sic broken block,Gem grade sic ingot , 5-15mm thickness sic scrap SiC Wafer Feature Property 4H-SiC, Single Crystal 6H-SiC, Single Crystal Lattice Parameters a=3.076 Å c=10.053 Å a=3.......
... to form a wafer stamping production line, which replaces the traditional gradual stamping mode along the material extending direction, reduces the generation of punching scraps, reduces the production proce...
..., feeder, swing unit, special straight side single-point mechanical press, rapid mold change device, stacking unit, scrap shear, hydraulic system, electrical control system, etc. 1....