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Basic Properties Property Condition/Unit Value Uncured Properties Appearance Non-flowable paste Tack-free time 23C, min 10 Cured Properties 7 days @ 23C, 50% RH Density g/cm 1.04 Hardness Type A 28 Ten...
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Description: The high-performance silicone-based adhesive cloth tape is specifically engineered for demanding industrial environments. It offers exceptional heat resistance, outstanding mechanical strength, and...
High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers Company Profile With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek ...
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Superior Dielectric Properties Silicone-Based Thermal Conductive Paste For Semiconductor Automatic Laboratory Equipment TIF®050-11P is a thermally conductivepaste with excellent interface thermal ......
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Good Thermal Conductivity Silicone-Based Thermal Conductive Paste For Semiconductor Automatic Laboratory Equipment TIF050-11P is a thermally conductivepaste with excellent interface thermal resistance characte...
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Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, m...
Thermal GAP PAD Materials 2.0W/MK Silicone-Based Thermal Gap Pad For For Advanced Cooling Needs The TIF®200-20-18U Series is a compound thermal interface material that ......