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B130LAW-7-F 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features Guard Ring Die Construction for Transient Protection Very Low Forward Voltage Drop Lead, Halogen and Antimony Free, RoHS Compliant Mechan...
BCP55 Transistors Surface mount Si-Epitaxial Planar Power dissipation Verlustleistung 1.3 W Plastic case SOT-223 Kunststoffgehuse Weight approx. Gewicht ca. 0.04 g Plastic material has UL classification 94...
FOD814 Series, FOD617 Series, FOD817 Series 4-Pin High Operating Temperature Phototransistor Optocouplers Features AC input response (FOD814 only) Applicable to Pb-free IR reflow soldering Compact 4-pin p...
Transient Voltage Suppressor 5.0 to 440 Volts 600 Watt Features For surface mount applicationsin order to optimize board space Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See or...
FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers Features AC input response (FOD814 only) Applicable to Pb-free IR reflow soldering Compact 4-pin package Current transfer r...
Inductors for Decoupling Circuits Wound/For Current FEATURES The product has good heat durability that withstands lead-free compatible reflow soldering conditions. Lead-free material is used for the plating...
(Capacitor type) Single Circuit Type for Large Current NFM18PS Series (0603 Size) FEATURES: Low ON Resistance Low Gate Charge ESD DiodeProtected Gate 100% Avalanche Tested These Devices are PbFree, ...
Product Description: The waffle box features a distinctive independent compartment design. In this design, every groove functions as a separate storage space, ensuring that each micro solder sheet has a designa...
...SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't co...
... SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't c...
... SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't c...
... SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't c...
... BI-COLOR SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product ...
... CHIP LED Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't conta...
... WHITE AND BLUE BI-COLOR CHIP LED Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)Th...
...SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't co...
...SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't co...
...VIEW RED SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product d...
...EE COLOR SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product d...
...SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't co...