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...EIA STD package. * I.C. compatible. * Compatible With Automatic Placement Equipment. * Compatible With Infrared And Vapor Phase Reflow Solder Process. Parameter Unit Power Dissipation 75 mW Peak Forward Curr...
...placement • Guardring for overvoltage protection • Low power losses, high efficiency • Low forward voltage drop • High surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q10...
..., flexibility, wide range of application and durability. The unit can be equipped with one or two filling heads for easy placement on the tabletop and control the filling volume with a high-precision piston....