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Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance Product description TIF100-10-01U Series is recommended for applications that require a minimum amount of pressure...
...Thermal Conductive Silicone Pad For Cpu Gpu Ram Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have r...
...GPU SSD IC LED Cooler Efficient Ultra-Soft 3.0 W/MK 0.25mm~0.5mm Thickness Silicone Heat Transfer Thermal Pad Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture ...
Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-te...
...GPU Cooling High Quality Thermal Conductive Pad For LED Drivers And AI Processors Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines...
...a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductiv...
...Thermal Pads GPU CPU Heatsink Cooling Conductive Silicone Thermal Pad Accessories Supplies Product descriptions TlF®100-20-10E use a special process, with silicone as the base material, adding thermal conduc...
...Thermal Pad Gpu SSD Thermal Pad Product descriptions TlFTM100-07S Series thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal...
... allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of ha...
...Thermally Conductive Potting Compound, a high thermal conductivity potting gel with a thermal conductivity of 2.0±0.1 W/M▪K. This electrically insulating thermal potting material is designed to meet the dema...
...GPU Graphics Card For Workstation 256bit NVIDIA RTX A6000 * Ampere GPU * 10,752 NVIDIA® CUDA® Cores * 336 NVIDIA® Tensor Cores * 84 NVIDIA® RT Cores * 48GB GDDR6 Memory with ECC * Up to 768GB/s Memory Bandwi...
White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,lon...
...Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone Thermal Gap Filler Product descriptions TlF700P is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional com...
...Thermal Conductive Silicone Pad For Lithium Battery Graphics Card GPU Product descriptions TlF700HP thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oi...
...Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone Product descriptions TlF700R use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together ...
...Thermal Conductive Insulator Thermal Conductive Silicone Insulator Pads For GPU Battery The TIS®807-09-01 Series of products are highly efficient insulating products and they also have thermal conductivity. ...
...Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance The TIS®812-11-03 Series of products are highly efficient insulating products and they also have thermal conductivity. I...
TIF100-20-05U Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB /GPU/SSD Product descriptions TlFTM100-20-05U Series thermally conductive interface materials are applied to ...
...Thermal Conductive Pad Fiberglass Reinforce Thermal Insulation Sheet For Computer CPU/GPU Cooling Product descriptions TIF®100 6045-50 is a well-balanced, general-purpose thermal conductive pad. It offers ex...
.... It is a chemical-resistant thermal encapsulation adhesive that meets the stringent requirements of GB/T 31838.2-2019 with a volume resistivity of 5.0×10^14 Ω·cm. This potting compound is available in three...