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...Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe TIF®030-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent therm...
...a heat conducting product in the shape of paste.They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation efficie...
...filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®030-05 has a higher viscosity, which effectively prevents filler separation from the...
...Thermally Conductive Putty Thermal congductive Gel For LED Lights Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials...
...Thermal Pad Thermally Conductive Silicon Protective Cushioning Material The TIF®500-20-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are ex...
... allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of ha...
...Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers The TIF®700PU Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitiv...
...offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring ......
Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive The TIF®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision c...
...Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision...
... of components after curing. Flame retardant, high and low temperature resistance from -50ºC to 250ºC (58°F to 432°F). Excellent electrical properties and Thermal conductivity. *...
...Thermally Conductive Potting Compound is a high-quality silicone thermal potting adhesive designed for electronics applications. With an operating time of 60-120 minutes at 25℃, this adhesive provides ample ...
... high thermally conductivity and reduces the weight more than 30% comparing with the same aluminium devices. Application TCP™100-30-06A can be used in applications such as Heat Sinking ......
...housing design which requires high thermally conductivity and reduces the weight more than 30% comparing with the same aluminium devices. Application TCP™100-25-06A can be used in applications such as Heat S...
... in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal ...
... Lamps Black Thermal Conductive Plastic Housing 5 W / mK with 1.45g / cm Specific Gravity TCP™200-50-01A is a Thermally Conductive Engineering Plastic developed for the housing design which requires high the...
... thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, ......
... adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal im...
...Heat Sinking Thermal Conductive Plastic TCP 100-01PP , 1 W-mK , RoHs and UL 1.55g/cm3, 94V0 TCP 100-01PP is a Thermally Conductive Engineering Plastic developed for the housing design which requires high th...
Application In Electronic Parts High Thermal Conductivity 3w Thermal Conductive Silicone Pad The TIF140-30-15ESeries is recommended for applications that require a minimum amount of pressure on components. The ...