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...thermal conductivity 240 W/ mK -40℃ ~250℃ black thermal graphite sheet 85 shore00 TIR 250CU 2.7 g/cc TIR™250CU products are a new material with highly effective heat conductivity and absorption, stabilized d...
...Thermal Conductive Pad-40 To 160℃ Conductivity 8.0W For Display Card Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materi...
...thermal conductive pad TIF5120US -40 to 160℃ conductivity 2.6W for display card Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal inter...
Die Cut Thermal Conductive Silicone Gap Filler Pad 12±5 shore00 Thermal Conductivity 1.5w for Cpu heat sinking The TIF120-05ES thermally conductive interface materials are applied to fill the air gaps between t...
...Conductive Soft Gpu Cpu Termal Pad TIF®100 12055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It ...
1.2W/m.K Thickness 0.5 mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop LED Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 AS...
1.2W/m.K Thickness 0.5 mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop LED Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 AS...
... Thermal Pad Thermal Gap Filler With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek ...
Thermal Interface Material 13W Soft Silicone Thermal Conductive Pad Gpu Cpu Light Thermal Gap Filler TIF®800Q series of thermal interface materials is specifically designed to fill air gaps between heat-generat...
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...thermal pad 27shore00 3.5mmT thermal gap filler pad TIF3140 2.8W conductivity for cooling electronic elements The TIF3140 Series is recommended for applications that require a minimum amount of pressure on c...
...thermal conductive pad, ultra soft 20shore00 For High speed mass storage drives Ziitek TIF5160-50-11US is an extremely soft gap filling material rated at a thermal conductivity of 5.0 W/m-K. It is specially ...
...thermal conductive gap pad 20±5 Shore 00,3.0 W/m-K for mainboard/mother board The TIF1160-30-11US is an extremely soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. It is specially formu...
... for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation...
...Thermal Conductive Graphite Sheet For Mass Storage Devices Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high per...
High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor, Medical Equipment, Mask Aligner Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziit...
TP120 Thermal Conductive Pad custom thickness thermal pads SSD thermal conductive silicone pad Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~......
...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K...
...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K) 3.0 ASTM D5470 Product feature ■ Thermal condu...