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...Thermally Conductive Pad 1.5W/M-K For Memory Modules Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive ins...
... thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silic...
...thermal gap pad 1.0mmT,27shore00 for SMD LED module Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insul...
Thermal Conductive Pad Super soft good thermal insulation with 1.5 W/m.K Ultra Soft Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Light Grey Visual ......
Low thermal resistance 3W/m.K thermal Conductive pad for Networking and Telecommunications Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Light Blue Visual Thickness(......
1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM ......
Grey Silicone Thermal Sheet Thermal Insulation Pad With Puncture Resistance For LED Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Grey ......
1.4W/m.K Thermal ConductivityYellow Silicone Soft Thermal Insulation Pad For Heat-Sink GPU Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness...
Thermal Conductive Pad Super soft good thermal insulation with 1.5 W/m.K Ultra Soft Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Light Grey Visual ......
Low thermal resistance 3W/m.K thermal Conductive pad for Networking and Telecommunications Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Light Blue Visual Thickness(......
1.2 W/m.k Thermal Conductivity 10.0 mm Thickness Ultra Soft Thermal Conductive Pad Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM ......
Grey Silicone Thermal Sheet Thermal Insulation Pad With Puncture Resistance For LED Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Grey ......
1.4W/m.K Thermal ConductivityYellow Silicone Soft Thermal Insulation Pad For Heat-Sink GPU Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness...
...pads in China. Our factory covers an area of 20,000 square meters, with more than 300 employees and more than 30 professional and technical engineers. Hope our products can provide customers with a better li...
... can provide customers with a better life. 1.More info about DHF please click this link: About DHF; 2.More info about our producing please click this link: DHF evaporative cooling pads producing picture; 3.M...
...Thermal Conductive Pad for Industrial and Consumer Electronics Thermal Management Company Profile Dongguan Ziitek Electronic Material and Technology Co., Ltd. is a professional manufacturer of thermal interf...
...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Product feature ■ Thermal conductivit...
...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Product feature ■ Thermal conductivit...
...Thermal Gap Pad Silicone Thermal Pad For Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). W...
...Thermal Gap Pad For Infrastructure Cpu Thermal Pad Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of t...