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Total 3299 products for thermal dissipation Manufacture & Suppliers

TIF100-18-11US High Performance 1.8W Thermal Conductive Sheet Thermal Gap Filler Pad For Telecommunication Equipment

...Thermal Conductive Pad Sheet Thermal Gap Filler For Telecommunication Equipment Product descriptions TlF®100-18-11US Series thermally conductive interface materials are applied to fill the air gaps between t...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100-20-50S Thermally Conductive Gap Filler Pads Series for Graphics Card Thermal Module

...Thermally Conductive Gap Filler Pads Series for Graphics Card Thermal Module Product descriptions TlFTM100-20-50S Series thermally conductive interface materials are applied to fill he air gaps between the h...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF700NES Thermal Conductive Silica Sheet Thermal Gap Filler Pad For Telecommunication Equipment

...Thermal Conductive Silica Sheet Thermal Gap Filler Pad For Telecommunication Equipment Product descriptions TIF®700NES Series thermally conductive interface materials are applied to fill the air gaps between...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100-30-11ES High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs

...applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to t...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100-30-11U Highly Efficient Thermal Conductivity 3.0W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials

... are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100-30-05U Thermal Pad 3.0W/Mk 0.25mm-5.0mm Thickness Thermal Silicone Conductive Pads For Automotive Engine Control Units

...Thermal Pad 3.0W/Mk 0.25mm-5.0mm Thickness Thermal Silicone Conductive Pads For Automotive Engine Control Units Product descriptions TlF®100-30-05U thermally conductive interface materials are applied to fil...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100-30-01E UL Certificated Soft Heat Sinking Thermal Conductive Pad 3.0W/MK Silicone Thermal Pad For Mainboard/Mother Board

...Thermal Conductive Pad 3.0W/MK Silicone Thermal Pad for Mainboard/Mother Board Product descriptions TlF®100-30-01E thermally conductive interface materials are applied to fill the air gaps between the heatin...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100-30-11F Sample Free 3.0 W/M.K Thermally Conductive Pad For LED/TV Heat Dissipation

... additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling....

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF00N-15-16E Silicone thermal gap pad for Graphics Card Thermal Module

... between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipa...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF500-30-11US-AS Great Thermal Conductivity Thermal Pad For Computer CPU/GPU Cooling

...Thermal Conductivity Thermal Pad For Computer CPU/GPU Cooling Product descriptions TlF®500-30-11U-AS series thermally conductive interface materials are applied to fill the air gaps between the heating eleme...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100L-2020-06 Low Volatility Silicone Based Thermal Gap Filler Pad For Graphics Card Thermal Module

...air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF200-10-02ES Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation

...Thermal Pad For Semiconductor Heat Dissipation Product descriptions The TIF®200-10-02ES Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical insulation,...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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Diamond Heat Dissipation Material Thermal Management For Electronic Packaging Heat Dissipation

...solve the heat dissipation problem of electronic devices and meet the requirements of lightweight applications. They can be used in power, radio frequency devices, electronic packaging and heat dissipation, ...

HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
Henan,China

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Good Adhesion Glass Fiber Mesh Strengthening High Temperature Heat Dissipation Double-Sided Tape Substitute screw

...fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the me...

Dongguan Ziitek Electronic Materials & Technology Ltd.
Guangdong,China

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Effective Silicone Thermal Pad for Enhanced Cooling Performance and Management

...thermal pads are the ideal choice to meet your diverse heat dissipation needs. In terms of material, high - quality silicone is selected, which has excellent softness and resilience. It can closely fit vario...

Shenzhen Antac Technology Limited
Guangdong,China

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TIF035-05 Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat

Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat TIF®035-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal ...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF100-30-06US 1.5mm To 5.0mm Thick 3.0W Ultra Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad

... allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF500-50-11US Thermal Silicone Pad 5.0W, High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

...material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF700PUS Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers

... components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for ...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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TIF500-40-11U Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers

... material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achievin...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
China

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