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...Thermal Conductivity 70MoCu For IGBT In EV / HEV Industry Description: With technology development, there are more need for higher power in smaller microelectronics components. This also increase the require...
... dissipation system “anti-static” circuit design Multiple panel LED indication Available customization shell color Specification Model MS-FPT201 Mechanism Printing method Thermal dot line Dot numbers(dots/li...
... Unique heat dissipation system “anti-static” circuit design Multiple panel LED indication Available customization shell color Customized case color Specification Model MS-FPT201 Mechanism Printing method Th...
...Thermal Printer For Queue Systems Features: Brand name printer mechanism Super big roll bucket diameter Max 56 mm Compact front panel mounted structure Unique heat dissipation system “anti-static” circuit de...
...Thermal Printer MS-FPT301 is 3 inch thermal printer with auto cutter & roll bucket roll bucket opening & close by button Features: Brand name printer mechanism Super big roll bucket diameter Max 80 mm Compac...
...Thermal Printer 3 inch thermal printer with auto cutter & roll bucket roll bucket opening & lock by key Features: Brand name printer mechanism Super big roll bucket diameter Max 80 mm Compact front panel mou...
... 80 mm Compact front panel mounting Ultra high printing speed max 200 mm/s Unique heat dissipation system Multiple panel LED indication Available customization case color Attention: Before plug in or plug ou...
...thermal printer 3 inch thermal printer with auto cutter & roll bucket roll bucket opening & lock by key Features: Brand name printer mechanism Super big roll bucket diameter Max 80 mm Compact front panel mou...
...thermal panel kiosk printer for ticket vendor Features : Unique locker design Brand name printer mechanism Super big roll bucket diameter max 80mm Compact front panel mounted structure Ultra high printing sp...
Thermally Conductive Silicone Potting Compounds Two-component silicone potting compound sealant for electronic component ∎Product Description ●SI8230 is two-component silicone based thermal conductive potting a...
...Thermal Composite PCB Introduction Designing high-frequency, high-power electronic systems can be a challenging task, particularly when it comes to managing heat dissipation and maintaining signal integrity....
... electronic applications. This high-performance product embodies exceptional thermal management capabilities, making it an excellent choice for LED applications, power circuits, and automotive systems, where...
...Thermally Conductive Black Encapsulating and Potting Compounds ∎Product Description ●SI8230 is two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulca...
..., can vulcanize to deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components...
..., can vulcanize to deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components...
...Thermal Solution for Electronics This titanium alloy heat sink is manufactured with precision CNC machining technology, designed for thermal management in high-power electronic devices. Titanium alloy's exce...
...-performance cooling solution manufactured from premium AL6063 and AL6061 aluminum alloys. This heat sink combines exceptional durability with superior heat dissipation capabilities, making it ideal for vari...
...thermal management components designed for efficient heat dissipation in electronics, LED lighting, power systems, and automotive applications. Manufactured from high-grade Aluminum 6061-T6 alloy, these heat...
...thermal management solutions, combining copper and aluminum construction with nickel plating for exceptional heat dissipation performance in demanding electronic applications. Product Overview This advanced ...
...Thermal Management This advanced liquid cooling heat sink efficiently manages heat dissipation in high-performance electronic devices. With compact dimensions of 120mm × 120mm × 25mm, it seamlessly integrate...