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4.5mmT thermal pad for CD-Rom, DVD-Rom cooling,3.0W/mK, 2.9 g/cc Company Profile Ziitek thermal conductive interface materials are widely recognized and trusted by users and can meet continuously developing eco...
high cost-effective thermal conductive pad,black silicone rubber pads 18 Shore 00, 1.8W/mK Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution an...
Display Card 2.0g/Cm Silicone Thermal Heatsink Insulator Pads 2.5 Mm thickness Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufactu...
factory supply Good thermal conductive Electrically isolating thermal gap pad for mother board,3.5mmT Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales o...
Outstanding thermal performance TIF1120-40-11US thermal pad for Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates to...
Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For Mass Storage Devices Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which genera...
3.2W/mK insulation UL Recognized Thermal Pad for Power Supply Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior ther...
...CPU The TIF160-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is ...
Product Description: Constructed from high-quality Silicone material, this Thermal Conductive Pad ensures excellent thermal conductivity with a thermal conductivity rating of 2.0 W/mK. This means it effectively...
High Voltage Resist Thermal Conductive Insulator Silicone Sheet for IGBT Company pfrofile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing s...
Thermal Conductive Insulating Silicone Sheet Material For New Energy TISTM112-02 Series products are the high-efficiency insulation ones with thermal conduction properties.The supplement of the insulation base ...
Product Description: Our Thermal Conductive Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. With a hardness of 45 ShoreC and a tensi...
Gray 8.0W Ultra Soft Thermal Pad on Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interfa...
3.0W Ultra Soft Thermal Pad With Hardness 12 Shore00 High-Performance Silicone Gap Pads For Electronic Components Company Profile A silicone thermal pad is a type of thermal interface material (TIM) which is hi...
Thermal Management 6.0W Thermal Gap Pads For AI Processors AI Servers Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are ex...
Thermal Gap Filler Designed To Provide Thermal Conductivity Of 2.0W/mK For Electronics Cooling Applications Products description The TIF100-15-01F Series is a structurally supportive thermal pad designed to pr...
... Silicone Thermal Pad For Automotive Electronics The Silicone Thermal Pad is a high-quality, heat-resistant product designed specifically for use in electronic devices such as CPU's, PMU's. Made from high te...
...thermally conductive compound developed by Dow Corning. It is designed to provide efficient thermal management for electronic devices by ensuring effective heat transfer from components to heat sinks. Produc...
...TIF015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better. TIF015-0...
... structure. This structure achieves directional optimization of the heat flow path through micro ordered arrangement, significantly doubling the macroscopic thermal conductivity efficiency. When the temperat...