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...Thermal Pad For Between Transistors And Heat Sinks Company profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We hav...
... in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers wor...
Good Heat Dissipation Thermal Conductive Silicone Gel Thermal Gap Filler Gel For Telecom Industry Company Profile With professional R&D capabilities and many year experiences in thermal interface material indus...
...Thermally Conductive Gap Filler Pads For Automotive Electronics AI Processors Products Description TIF®200-15-27E Series is a compound thermal interface material that combines good thermal conductivity, reli...
... in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers wor...
High Performance 85 Shore A Thermal Conductive Interface Graphite Sheet TIR™ 332 Thermal Conductivity 1500 W/mK TIR™ 332 Series products are high performance thermal conductive interface materials. The unique g...
...ether to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive: 1.0W/mK > RoHS...
... powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good the...
... powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good the...
...Thermal Conductive Silicon Pad For Monitoring The Power Box Product descriptions TlF®100-15-27E use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant...
... retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1...
...Thermal Pad Product descriptions TlF®500-50-11U use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal ...
..., adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the hea...
...Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU Product descriptions TlF®100-20-10S use a special process, with silicone as the base material, adding the...
..., adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the hea...
...Thermal Conductivity: 5.0 W/m-K High-compliance, low compression stress;Fiberglass reinforced for shear and tear resistance. Used in telecommunications, Integrated circuits ,digital signal processing systems...
... devices. TIF500US Datasheet -REV02.pdf Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We...
...Thermal Conductive Phase Change Silicone Pad Sheet For Laptop CPU GPU Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We ...
...Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR Company Profile Ziitek Electronic Material and Technology Ltd With professional R&D capabilities and many year experiences in thermal int...
...Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularitie...