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Low Thermal Resistance High Heat Graphite Materials 6W/MK Ultra-Thin Graphite Sheet The TIR™620 Series products are high-performance and heat-conductive interface materials with the reasonable prices. They can ...
Ultra High Thermal Conductivity Graphite Sheet Meets EU Environmental Standards The TIR™600 Series products are high-performance and heat-conductive interface materials with the reasonable prices.They can be us...
..., and thus maximizes the ability of heat conduction. TIR300 Series Datasheet-(E).pdf Feature Easy to assemble Ultra-thin type RoHS Compliant Thermal Conductivity:...
High Thermal Conductive 6 W/MK Carbon Graphite Sheet 2.2 g/cc For Notebook Computers The TIR™606 Series products are high-performance and heat-conductive interface materials with the reasonable prices. They can...
Manufacturer Wholesale High Thermal Conductive Flexible Graphite Sheet For Smart Phone TIR™600 Series products are high-performance and heat-conductive interface materials with the reasonable prices.They can be...
High Temperature Resistance Thermal Conductive Ultra-Thin Graphite Sheet For Laptop Notebook And Projector TIR620 Series products are high-performance and heat-conductive interface materials with the reasonabl...
... and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. A-gaphite 800 can be suppli...
...thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers ......
...Sheet For LED Ceilinglight Pink TIF100-40-14E , 35 Shore 00 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior the...
Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices Company Profile With professional R&D capabilities and many year experiences in thermal interface ma...
Heat Sink CPU Thermal Grease for Electron Component Discription of CPU Silicone Grease : CPU Thermal grease is a material used to fill the gap between the CPU and the heatsink, which is also called thermal int...
... thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 4.0 W/ m·K It contains metal powder to enhance thermal conductivity and non-insulating Very small interface th...
... thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 6.2 W/ m·K It contains metal powder to enhance thermal conductivity and non-insulating Very small interface th...
TIF100 10055-62 Thermally Conductive Heat Transfer Pad Silicone Sheet Thermal Pad For Automotive Electronics Product descriptions TIF®100 10055-62 series of thermal interface materials is specifically designed ...
...Thermal Performance Heat Sink Pad for IT Infrastructure The TIF140N-40-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the...
...Thermal Gap Pad, 2.5g/cc, 18 Shore 00 for Audio Video Components The TIF160-18-01US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to...
...thermal conductive gap pad for AD-DC Power Adapters,2.0 g/cc,1.2 W/m-K The TIF120-12-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant toget...
... together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. TIF100N-40-10F-Specification-sheet.pdf Feature...
...Thermal Pad for Notebook The TIF1180N-50-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal in...
... Silicone thermally conductive compound White paste Non-curing type Product Features Thermal conductivity: 3.2 W/ m·K Solvent-free, metal powder-free for insulation requirements Very small interface thicknes...