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...Thermal CTP plate making machine Technical specification Model 1464 No. of Lasers 64 Throughput (1130x800mm) (plates/hour) 14 PPH Max./Min. Format Max.: 1180mmx1460mm Min.: 508mmx394mm Laser Source 830 nm Re...
...Thermal CTP plate making machine Technical specification Model 14128 No. of Lasers 128 Throughput (1130x800mm) (plates/hour) 27 PPH Max./Min. Format Max.: 1180mmx1460mm Min.: 508mmx394mm Laser Source 830 nm ...
...Thermal CTP plate making machine Technical specification Model 1796 No. of Lasers 96 Throughput (1130x800mm) (plates/hour) 17 PPH Max./Min. Format Max.: 1460mmx1650mm Min.: 508mmx394mm Laser Source 830 nm Re...
... and long-lasting. With a maximum printing times of 150000, the plate can be used for a long period without any significant wear and tear. The Thermal CTP Plate is a blue-colored plate that is easy to use an...
... and handling during the printing process. As a thermal computer to plate plate, this product provides a reliable and predictable printing experience. This is due to the high-quality materials used in its co...
... printers seeking efficient and cost-effective solutions for their printing needs. Printers can rely on the Thermal CTP Plate to consistently deliver sharp and clear images, meeting the demands of high-volum...
... technology, this plate offers exceptional performance and reliability for printing professionals seeking precision and efficiency in their production processes. With its superior thermal sensitivity and fas...
... Conductive Pad For GPU Cooling High Quality Thermal Conductive Pad For AI Processors The TIF®100-50-56E Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and mo...
TIF®600P Premium Soft Silicone Thermal Pad For AI Processors The TIF®600P Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced de...
... components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for ...
... interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softnes...
...Thermally Silicone Pad For AI Processors AI Servers Product descriptions TIF®500-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extr...
... interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softnes...
... designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a ...
High Compliance 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation Product descriptions The TIF®100-15-14S Series is a well-balanced, general-purpose thermal pad.It offers g...
Good flexibility and fillability Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers TIF®100-50-50E Series is a well-balanced, general-purpose thermal pad. It offers excellent thermal conductiv...
...Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers Product descriptions TIF®100-40-11E Series is a wellbalanced, general-purpose thermal pad. It offers high t...
... thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level ...
... High Performance 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers Product descriptions The TIF®700NS Series a well-balanced, general-purpose thermal pad. It offers excellent thermal conducti...
...Thermal Grease for High-Performance Processors Product Introduction: Shin-Etsu X-23-7921-5 Thermal Grease Basic Properties Shin-Etsu X-23-7921-5 is a non-solvent thermal interface material designed for high-...