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... a two-component, low viscosity organic silicone. It has an excellent thermal conductivity and good fluidity, with a 1:1 mixed ratio. It can cure at room temperature or with heat .It is mainly used for potti...
7580 polyurethane hot melt adhesive for Mobile phone Product Features: 7580 reactive polyurethane hot melt adhesive is a kind of solid content of one component reactive hot melt adhesive 100%. Peel strength wit...
...Potting Gel High Thermal Conductivity for LED Driver Power Module Encapsulation HN-8806A/B is a waterproof RTV silicone potting gel and two-component high thermal conductivity potting compound that cures at ...
0 Shore A Waterproof Liquid Silicone Gel 2 Components Transparent Gel Silicone for PCB Junction box electrical insulating gel Product Description: HN-6607AB is a very soft, low crosslinking density addition sil...
Ultra-Soft Two-Component Silicone Gel for IGBT Module Encapsulation HN-6607A/B (product series) is a very soft, low-crosslink-density two-component addition-cure silicone gel supplied as a 1:1 (A:B) liquid syst...
...Component Thermal Conductive Waterproof Silicone Potting HN-8808 Shockproof Coating • Custom OEM • RoHS Compliant HN-8808 is an RTV two-component thermal conductive waterproof silicone potting compound deliv...
...Thermal Conductive AB Potting Adhesive for Waterproof Electronic Sealing Hanast HN-8806A/B is a two-component addition-cure silicone potting adhesive that cures at room temperature or under heat to a grey, 4...
STC07 Series surface mount toroidal coils and common mode toroidal choke,SMD Common mode inductor,pad size 16.5*17.5mm FEATURES: · Inductance: 1mH to 39mH · Rated current: 0.3A to 2A · Higher Frequency · High S...
... of components after curing. Flame retardant, high and low temperature resistance from -50ºC to 250ºC (58°F to 432°F). Excellent electrical properties and Thermal conductivity. *...
Product Description: One of the key benefits of this product is its low water absorption rate. With a water absorption rate of just 0.10-0.20% by weight after 23℃×10days, this epoxy resin is highly resistant to...
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Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:70-90℃。 Formulatio...
Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:70-90℃。 Formulatio...
Product Description Property Bi-ecomponent Epoxy resin system/liquid can be used to processes of APG&Conventional casting process undervacuum.Excellent splitting resistance&heat resistance TG:80-100℃。 Formulati...
Production details: Epoxy resin LE-8516 100 pbw Formulation Hardener LH-8516 100 pbw Filler Silica Flour 300-350 pbw Color paste LC series * 3 pbw LE-8516 is a modified saturated epoxy resin system. LH-8516 is ...
Product Description Bi-component alicyclic saturated structure epoxy resin system /liquid can be used to the processes of APG& Conventional casting process under vacuum,Excellent UV resistance &heat shock resis...
Product Description Property Bi-component Epoxy resin system/Liquid can be used to processes of APG&Conventional casting process under vacuum.Excellent splitting resistance&heat resistance TG:90-110. Epoxy resi...
Product details Product Description Property Bi-component Epoxy resin system/Liquid can be used to processes of Conventional casting process under vacuum. Excellent splitting resistance& heat resistance TG:100-...
Liquid Epoxy Resin and Hardener for Electric Insulators(casting process) Property Bi-component Epoxy resin system/Liquid can be used to processes of Conventional casting process under vacuum. Excellent splittin...
... that functions as a thermal adhesive, electrical insulator, and environmental sealant in a single material. Engineered for motor winding encapsulation and transformer coil potting—its 18-25 kV/mm dielectric...