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White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,lon...
...Thermally Conductive Potting Compound: HN-8820 RTV potting gel offers V-0 flame retardancy and reliable performance from -40°C to 150°C. It ensures long-term durability for demanding applications. Performanc...
...Thermally Conductive Potting Compound is a high-quality silicone thermal potting adhesive designed for electronics applications. With an operating time of 60-120 minutes at 25℃, this adhesive provides ample ...
...life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. TIE280-12AB-Series-Datasheet (1).pdf Features > Good thermal conductive: 1.2W/mK > Excellent in...
TISTM680-15AB 1.5w/Mk Thermal Potting Compound Silicone Thermal Conductive Resin Potting Compound AB Glue TIS™680-15AB is a two-component, high thermal conductive, low temperature cured, long pot life, fire res...
... for extreme heat dissipation requirements in power-dense electronic systems. With a thermal conductivity rating of ≥2.0 W/m·K, low water absorption, and UL94 V0 flame retardancy, it provides exceptional the...
...component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing o...
...power electronic systems requiring enhanced heat dissipation. With a thermal conductivity rating of ≥1.5 W/m·K, UL94 V0 flame retardancy, and wide temperature tolerance, it delivers reliable insulation, mech...
Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting TIS™ 680-10AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant ...
...thermal conductivity and electrical insulation UL94-V0 Thermal potting compound Product Description BZ-3900-G3.5 is a room-temperature/hot-curing addition-curing silicone material. This two-component elastic...
TIS680-12AB Gray 1.2W/MK Two Compound Thermally Conductive Potting Compound For Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature ...
...adhesive containing high-purity thermally conductive fillers. It features high thermal conductivity, low shrinkage, high bonding strength, and excellent thermal shock resistance. Ready-to-use,it is suitable ...
... cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. Features > Good thermal conductive: 1.2W/mK > Excellent insulation and smoothl...
...Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue Product Summary: TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond...
...Thermal Conductivity Silicone Potting Compound Product Description BZ-3900-G2.5 is a heavy-duty two-component addition-cure silicone potting compound engineered for extreme heat dissipation in high-power ele...
... epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. Features > Good thermal conductive: 1.2W/mK > Excellent insulation and smoothly sourface. > Low shrinkage > Low vis...
... epoxy encapsulant compound. lt is design for potting of capacitors and electricaldevices. TIE280-12AB-Series-Datasheet (2).pdf Feature > Good thermal conductive: 1.2W/mK > Excellent insulation and smoothly ...
...Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy Product Summary: TIETM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity and bond strength. TIET...
... of components after curing. Flame retardant, high and low temperature resistance from -50ºC to 250ºC (58°F to 432°F). Excellent electrical properties and Thermal conductivity. *...