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...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
... Layer:2 Thickness:1.6mm Surface: ENIG Hole:0.5 Specification: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of sub...
...FR4 Material Layer:2 Thickness:1.6mm Surface: ENIG Hole:0.5 Specification: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing mat...
... Soldermask White Silkscreen Motor Control Board,FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bo...
... Electronic Board Green Soldermask White Silkscreen, FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate....
...Hole:0.5 Specification: Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen, FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with elect...
... Electronic Board Green Soldermask White Silkscreen, FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. It...
... Surface: ENIG Hole:0.5 Specification: Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen, FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as bin...
...: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and...
...Hole:0.5 Specification: Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen, FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with elect...
...Hole:0.5 Specification: Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen, FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with elect...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
...winches typically have bolt holes at the bottom or side of the housing for mounting. A common type of manual winch is manual boat anchor winch widely used for loading and unloading boat. FAQ 1. Load Binder, ...
...Hole Diameter Tungsten Carbide Wire Drawing Dies Wire drawing dies application 1. Nonfeerous wire, including copper, aluminium, electromagnetic and stainless steel wire. 2. Platinum rhodium wire 3. Gold wire...
... magnesia raw material and special organic binder,solves the problem of easy damage for converter trunnion and steel-tapping hole. Features: Product features: Fast setting rate, high temperature strength, me...
...the report binder, Compared to the other small paper guillotine, this A5 rotary paper trimmer could cut more sheets, up to 10 sheets of 80gsm copy paper. It is an ......
...small 9 inches / A5 small paper cutting machine is a mini paper trimmer, it has two holes for being stored in the report binder, Compared to the other small paper guillotine, this A5 rotary paper trimmer cou...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...
...epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner co...