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... ripened peppers, these diced cubes are characterized by their Vibrant Red hue and naturally Sweet taste. The IQF (Individual Quick Freezing) technology locks in these premium ......
Abstract Fully Automatic Precision Dicing Saw equipment for 8inch 12inch Wafer Cutting The fully automatic precision dicing saw is an advanced semiconductor cutting system designed for high-precision separation...
...dicing saws Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding a...
...dicing saws Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding a...
...dicing saws Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding a...
...dicing saws Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding a...
...new season Supplying Frozen IQF Strawberry Whole and Dices Sweet Charlie/AM13, Strawberry Dices Product name 2018 new season supplying Frozen IQF Strawberry Whole and Dices Sweet Charlie/AM13, Strawberry Dic...
... with the vehicle. Communication makes diagnosing and troubleshooting the vehicle possible, as well as downloading software. 2.DICE has an integrated CARB cable, which is connected to the vehicle's diagnosti...
...dicing saws Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding a...
...dicing saws Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding a...
...dicing saws Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding a...
...dicing saws Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding a...
Model Application Machine Size (mm) Power (kw) Weight (kg) Voltage (V) Cutting size Output Product function HQC-611 Bulbous vegetable 750×480×890 0.75 80 220 dices:8,10,12,15,20mm silk:2,3,4,5,6,8mm slices:2-20...
Model Application Machine Size (mm) Power (kw) Weight (kg) Voltage (V) Cutting size Output Product function HQC-611 Bulbous vegetable 750×480×890 0.75 80 220 dices:8,10,12,15,20mm silk:2,3,4,5,6,8mm slices:2-20...
... function HQC-611 Bulbous vegetable 750×480×890 0.75 80 220 dices:8,10,12,15,20mm silk:2,3,4,5,6,8mm slices:2-20mm 300-500 KG/H Cut slice/Dicing/silk Contact us Certifications Company Information FAQ Q1:Can ...
...Product function HQC-612D 900*710*1260 0.75 102 380 3-20mm (Non-adjustable) 1000 Dicing Certifications Company Information Contact us FAQ Q1:Can you accept OEM? A1: Yes, we can. We had 12years OEM experience...
... vegetable 750×480×890 0.75 80 220 dices:8,10,12,15,20mm silk:2,3,4,5,6,8mm slices:2-20mm 300-500 KG/H Cut slice/Dicing/silk Contact us Certifications Company Information FAQ Q1:Can you accept OEM? A1: Yes, ...