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... form factor Intel MAX 10 FPGA module suitable for space-constrained embedded and portable applications requiring ultra-low power consumption, integrated connectivity and long-term availability. Key Features...
... form factor Intel MAX 10 FPGA module suitable for space-constrained embedded and portable systems requiring ultra-low power consumption, integrated connectivity and long-term availability. Key Features: 1,2...
... requiring low power, robust I/O integration and long-term supportability. Key Features: 1,477 Logic Elements Integrated USB 2.0, Gigabit Ethernet and CAN interfaces Ruggedized DDR3L and flash memory support...
... applications requiring low power, integrated connectivity and long-term longevity. Key Features: 717 Logic Elements Integrated USB OTG, SDIO and Intel Transceiver I/O interfaces Industrial-grade memory supp...
... integration into industrial and embedded machine vision systems. Featuring USB 3.0 interface with 5 Gbps bandwidth, this module provides both power and data over a single cable while maintaining an extremel...
... Power Factor 0.93Ph in and 3Ph out 4. SNMP+USB+RS232 Multiple Communications 5. Optional N+X Parallel Redundancy 6. Wide Input Voltage Range (110~300VAC) 7. Optional Transformer Offers Full Isolation Key Fe...
...230/240VAC Input power factor: >0.9 Phase:Three phase input/three phase output SNMP+USB+RS-232 multiple communications. Key Features 1.DSP technology guarantees high performance. 2.Emergency power off functi...
... Power Factor 0.93Ph in and 3Ph out 4. SNMP+USB+RS232 Multiple Communications 5. Optional N+X Parallel Redundancy 6. Wide Input Voltage Range (110~300VAC) 7. Optional Transformer Offers Full Isolation Key Fe...
...230/240VAC Input power factor: >0.9 Phase:Three phase input/three phase output SNMP+USB+RS-232 multiple communications. Key Features 1.DSP technology guarantees high performance. 2.Emergency power off functi...