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Ultra Fine Wire 0.01mm diameter Gold Plated Tungsten Wire For Electronic And Semiconductor Applications * This remarkable material is composed of high - purity tungsten material. The purity of this tungsten rea...
High Melting Point Ultra Fine Gold Plated Tungsten Wire Corrosion Resistance Composed of high purity tungsten material with a purity of at least 99%, along with added alloy ......
Ultra Fine Gold Coated Silver Alloy Wire for for Superior Oxidation Resistance and Stable Performance Electrical, Thermal, and Corrosion - resistance Properties This ......
Premium Ultra Fine Wire Gold Bonding Wire for Advanced Electronic Bonding Applications Winner stands out in the industry by specializing in the manufacturing of gold balls and wedge bonding applications with an...
Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics Winner can control the diameter of gold bonding wires depending on the customers requests. Winner is a leading suppl...
High tensile strength with high elongation 0.01 mm Ultra Fine Copper Bonding Wire for Automotive Description of Copper Bonding Wire The Copper bonding wire is material for semiconductor packaging which has exce...
High conductivity 0.01 mm Ultra Fine Wire Copper Bonding Wire for Electronics and Communications Copper bonding wires are excellent for bonding in a ball / wedge process when using a ......
Ultra Fine wire Good loop stability 0.01 mm Copper Bonding Wire for Communications Characteristics * High conductivity * High tensile ......
Good Reliability at High Temperatures Ultra Fine wire 0.01 mm Cu Bonding Wire for electronics package Copper bonding wires have grown in popularity as a means of making ......
Copper Bonding Wire Ultra Fine wire 0.01 mm with High Levels of Electrical and Thermal Conductivity In many applications, copper wire bonding can provide better performance and reliability than gold wire bondin...
Ultra Fine 0.01mm diameter Professional Grade Palladium Coated Copper Wire with Higher Hardness for Semiconductor Packaging When using PCC bonding ......
High Conductivity Ultra Fine 0.01mm diameter Pd Coated Copper Wire for Optoelectronic Packaging Quality of the Palladium Layer : thickness, uniformity & density. Uniform & ......
Ultra Fine Wire 0.01mm diameter Palladium Coated Copper Wire for for Integrated Circuits Palladium Coated Copper Wire Impurity Content: ......
Microelectronic Packaging's Choice Ultra Fine 0.01mm diameter Copper Palladium Alloy Wire and for Integrated Circuits High-reliability CHR PCC wires have proprietary doping that ......
High-Quality Ultra Fine Wire 0.01mm diameter Beryllium Copper Wire for Precision Electronics Manufacturing Corrosion Resistance: Beryllium Copper Wire has good ......
0.01mm Diameter Ultra Fine Gold Plated Molybdenum Wire for Medical and Electronics Industries Our plating technology is constantly improved and this work is facilitated by the fact that we are also designing ou...
Flexible 0.01mm Ultra Fine Wire Palladium Plated Copper Wire for Circuit Board Interconnects Palladium plated copper wire combines a copper core, ......
High Purity Ultra Fine 0.01 Diameter Gold Plated Copper Wire for Microelectronics Gold Plated Copper Wire - High-Quality Wiring Solution Our Gold Plated Copper Wire is a meticulously crafted product, offering a...
High Purity 0.01mm Gold Bonding Wire for Microscale Electronics Our ultra-fine gold bonding wire (0.01mm diameter) delivers 99.99% purity, ideal for precision microscale electronics, semiconductor pack...
Customizable Ultra Fine Gold Bonding Wire for Precision IC & Semiconductor Packaging Our high-purity gold bonding wire is specially engineered for inner ......