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... use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. All our chip is FULL CAPACITY. PCBA inside: PCBA Specification: 1) Memory Available: 8/16/32/64GB. 2) Interface: USB 3.0. 3) Data Retention: At least ...
... use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. All our chip is FULL CAPACITY. PCBA inside: PCBA Specification: 1) Memory Available: 8/16/32/64GB. 2) Interface: USB 3.0. 3) Data Retention: At least ...
...USB 3.0 USB memory stick. 2. Any logo can be done. 3. Multi capacity. 4. Fast data transfer speed. What is important inside Usb 3.0 Flash Drive? Memory Chip. We use Samsung, Toshiba, Micron, Hynix, Sandisk a...
...USB 3.1 USB memory stick. 2. Any logo can be done. 3. Multi capacity. 4. Fast data transfer speed. What is important inside Usb 3.0 Flash Drive? Memory Chip. We use Samsung, Toshiba, Micron, Hynix, Sandisk a...
...USB 3.1 type-C USB memory stick. 2. Any logo can be done. 3. Multi capacity. 4. Fast data transfer speed. What is important inside Usb 3.0 Flash Drive? Memory Chip. We use Samsung, Toshiba, Micron, Hynix, Sa...
..., Toshiba, Micron, Hynix, Sandisk and Intel. 100% FULL CAPACITY is guarantee. PCBA inside: PCBA Specification: 1) Memory Available: 1/2/4/8/16/32/64GB. 2) Interface: USB 2.0. 3) Data Retention: At least 10 y...