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... a high-performance solution for various applications. This chip provides high-speed digital signal processing capabilities and is designed for use in a wide range of systems. It is capable of providing a wi...
...Chip Product Description: The XC7A75T-2FGG676C Programmable IC Chip from Xilinx is a Field Programmable Gate Array (FPGA) that is designed to deliver the highest system performance and capacity for a wide ra...
.... This IC chip is designed to provide enhanced performance and high-speed signal processing in critical applications. It is manufactured using the latest technology and is designed to operate at a maximum sp...
XC2C64A-7VQG100C Programmable IC Chip High-Performance Logic for Enhanced System Design XC2C64A-7VQG100C Programmable IC Chip Product Specifications: - Device Type: Programmable IC Chip - Part Number: XC2C64A-7...
...package, featuring an 8-SOIC design, making it easy to install and use. It is suitable for a wide range of applications, including pre-amplifier and professional audio. This chip offers differential output, ...
... is an advanced digital integrated circuit chip board circuit that features a 16-SOIC device package and an SPI interface, making it suitable for surface mounting. With its state-of-the-art design and advanc...
... current is 2.5mA. It offers an operating supply voltage from 2.5V to 5.5V and the current-output high and low are 24mA and 24mA respectively. The chip is designed with a surface-mount mounting type and is s...
... & Sanan) Warranty:10,000Hrs or 2 years Design Advantage:1,Long life span 2,low thermal resistance 3,High effiency 4,Ingorganic encapsulation Appilcation:1,LED plant Growing Market;2,UV curing,Inkjet curing;...
...chip design, boasting hashrates of 72TH/s, high single-chip computing power, low cost to performance ratios, and optimized unit computing power cost. Features Safety and Quality Built-In AI Chip Simple Deplo...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...