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CC1110F32RHHR Integrated Circuit Chip QFN36 High performance Wireless RF transceiver Description The CC1110Fx, CC1111Fx is a true low-power sub- 1 GHz system-on-chip (SoC) designed for low power wireless applic...
...Chips HFBR-1521Z Original Electrnoics Parts Pressure sensor chips HFBR-1521Z Description The Versatile Link series is a complete family of fiber optic link components for applications requiring a low cost so...
...: 0.10-2200μF / 2.5-50V Not recommended for new designs, higher voltage or smaller case size substitution are offered. Released codes Engineering samples - please contact manufacturer Note: Voltage ......
ADT1-1WT1 Circuit Board Chips Integrated Circuit Chip Power Electronics Components RoHS peak reflow temperature rating 245C IEEE 802.3af/ANSI X3.263 compliant performance Designed for IP phone or switch applica...
H2017NL Integrated Circuit Chip Power OVER Ethernet (PoE) Magnetics RoHS peak reflow temperature rating 245C IEEE 802.3af/ANSI X3.263 compliant performance Designed for IP phone or switch applications STOCK LIS...
... Operating Temperature: -40°C to 100°C Vcc: 16 V Introducing the latest in programmable IC chips - the Spartan-6 Family Overview. This innovative product is designed to provide high performance, low power co...
... CMOS dynamic random access storage device with multi-chip package (MCP) and package overlay (PoP) design to save PCB space. LPDDR4 memory devices are ideal for handheld devices, battery-powered applications...
...Chip MT53E768M32D4DE-046 AIT:E Automotive Memory IC 200-TFBGA Surface Mount Description Of MT53E768M32D4DE-046 AIT:E MT53E768M32D4DE-046 AIT:E Automotive Memory IC is a high-speed CMOS dynamic random access ...
...) is a high-speed CMOS dynamic random access storage device. The memory device uses multi-chip package (MCP) and package stack (PoP) design to save PCB space. Typical applications include automotive, industr...
...Chip MT53E256M32D2DS-046 AAT:B 8Gbit SDRAM Mobile LPDDR4 Memory IC Product Description Of MT53E256M32D2DS-046 AAT:B MT53E256M32D2DS-046 AAT:B LPDDR4 Memory optimized to solve power consumption problems in ba...
...) is a high-speed CMOS dynamic random access storage device. The memory device uses multi-chip package (MCP) and package stack (PoP) design to save PCB space. Typical applications include automotive, industr...
...Chip MT53E256M16D1FW-046 AAT:B 4Gbit Parallel SDRAM Mobile Memory IC Product Description Of MT53E256M16D1FW-046 AAT:B MT53E256M16D1FW-046 AAT:B Memory optimized to solve power consumption problems in battery...
...Chip MT53E256M32D2DS-046 AIT:B SDRAM Mobile LPDDR4 Memory 200-WFBGA Product Description Of MT53E256M32D2DS-046 AIT:B MT53E256M32D2DS-046 AIT:B is optimized to address power consumption in battery-powered app...
Memory IC Chip MT53E256M32D2DS-053 AUT:B 8Gbit 1.866 GHz SDRAM - Mobile Memory Product Description Of MT53E256M32D2DS-053 AUT:B MT53E256M32D2DS-053 AUT:B is designed in multi-chip package and Package stack to s...
... in battery-powered applications. These memory devices are designed in multi-chip packages (MCP) and package stacks (PoP) to save PCB space. Specification Of MT53E128M32D2DS-046 AIT:A Memory Size: 4 Gbit ......
...Chip MT53E1G32D2FW-046 AUT:A 32Gbit Parallel 2.133 GHz LPDDR4X Memory Product Description Of MT53E1G32D2FW-046 AUT:A MT53E1G32D2FW-046 AUT:A 32Gb Mobile low-power DDR4 SDRAM (LPDDR4x) is a high-speed CMOS dy...
... CMOS dynamic random access memory. The memory device is designed in multi-chip package (MCP) and package stack (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 ......
...Chip MT53E1G64D4NW-046 WT:C 64 Gbit SDRAM LPDDR4 Memory IC 432-VFBGA Product Description Of MT53E1G64D4NW-046 WT:C MT53E1G64D4NW-046 WT:C 64Gb low-power SDRAM (LPDDR4) is a high-speed CMOS dynamic random acc...
...Chip MT53E1G32D2NP-053 RS WT:C 32G DRAM LPDDR4 Memory IC Surface Mount Product Description Of MT53E1G32D2NP-053 RS WT:C MT53E1G32D2NP-053 RS WT:C is a high-speed CMOS dynamic random access storage device opt...
... mode is reduced to 1/5. These memory devices are designed in multi-chip packages (MCP) and package stacks (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 ......