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...IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP). Anti-static tray is an ideal tool for storing electron...
... is typically a plastic tray with pockets sized up for a particular die size. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer...
... particle generation Cleanroom compatible (wafer-level) Stable ESD protection Custom cavity available Specifications Brand Hiner-pack Model HN24227 Material PPE Package ......
...one of the Wafer Level Packing (WLP) vanadium oxide (VOx) microbolometer detectors. This VOx uncooled focal plane detector covers long wavelength from 8 to 14μm. And its resolution is 256x192 with pixel size...
... Cameras Product Description TIMO120 miniature infrared module integrates wafer-level optics, 120x90 / 17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal ima...
... / 17μm wafer level package (WLP) infrared imaging detector that adopts the market preferred VOx material. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing ...
... resolution and 17μm pixel size. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement. Thanks to the wafer level packaging technology, ...
..., 120x90 / 17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal images of the target area and heat distribution. ......
..., high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integ...
... (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturin...
... Cameras Product Description TIMO120 miniature infrared module integrates wafer-level optics, 120x90 / 17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal ima...
... Cameras Product Description TIMO120 miniature infrared module integrates wafer-level optics, 120x90 / 17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal ima...
... Cameras Product Description TIMO120 miniature infrared module integrates wafer-level optics, 120x90 / 17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal ima...
...wafer-level package (WLP) microbolometer detectors developed by BeyondView. This vanadium oxide (VOx) uncooled focal plane infrared detector covers long wavelengths from 8 to 14μm, with a resolution of 256×1...
...wafer-level package (WLP) microbolometer detectors developed by BeyondView. This vanadium oxide (VOx) uncooled focal plane infrared detector covers long wavelengths from 8 to 14μm, with a resolution of 256×1...
...wafer-level package (WLP) microbolometer detectors developed by BeyondView. This vanadium oxide (VOx) uncooled focal plane infrared detector covers long wavelengths from 8 to 14μm, with a resolution of 256×1...
...Glass Semi-Automatic Room Temperature Bonding Machine is a precision device for Wafer-Level or Chip-Level bonding. Mechanical pressure + surface activation technology enables permanent bonding between materi...
... retention: 10 years - Endurance: 100,000 program/erase cycles - Packaging: Wafer/Chip Scale Package (WSP/CSP) Applications: - Embedded systems - Automotive systems - Industrial systems - Mobile and consumer...
Voltage Level Translator Bidirectional 4 Circuit 1 Channel 2Mbps, 24Mbps 12-CSP (1.37x1.87)...
Voltage Level Translator Bidirectional 4 Circuit 1 Channel 2Mbps, 24Mbps 12-CSP (1.37x1.87)...