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...applicable to various password covers such as telephone cards, red cards, game cards, and stored value cards. It uses thermal compound adhesive, and is firmly bonded by heat and pressure, and is prevented fr...
Product Introduction IXPE foam is produced by compounding PE with some special padding and foaming material,then cross linking by irradiation and foaming which is considered as polymer material, expect the prop...
Product Introduction IXPE foam is produced by compounding PE with some special padding and foaming material,then cross linking by irradiation and foaming which is considered as polymer material, expect the prop...
personalized Printed Water Activated Cloth Duct Tape For cargo Shipping Packing Product Description: Material: Thermal compound of polyethylene and gauze fiber Adhesive/Glue: Hotmelt adhesive and rubber adhesiv...
...Multi-functional Coating Machine Equipment Introduction 1.Extent coating and compound distance, more suitable for thermal paper adhesive produce and other temperature resistance material compound. 2.With hig...
...compounds with high boiling points, low volatility, high molecular weights, various polarities, and poor thermal stability. HPLC are used to analyze biologically active substances, polymers, natural polymer ...
... standard, 94V0 grade, UL number: E513688 2.Low viscosity, good fluidity, easy to penetrate; 3.moderate curing speed; thermal conductivity between 1.2~1.5. 4.After curing,...
...Compound For Electronic Components Encapsulation Quick Detail: Name Epoxy Resin 1311 Usage Epoxy floor coatings Mixing Ratio A: B =2:1 (By weight) Applications Epoxy floor coatings,Electronic component potti...
... standard, 94V0 grade, UL number: E513688 2.Low viscosity, good fluidity, easy to penetrate; 3.moderate curing speed; thermal conductivity between 1.2~1.5. 4.After curing,...
...Compound For Electronic Components Encapsulation Quick Detail: Name Epoxy Resin 1311 Usage Epoxy floor coatings Mixing Ratio A: B =2:1 (By weight) Applications Epoxy floor coatings,Electronic component potti...
...compound with a molecular weight of 81.39 G/mol, known for its numerous applications in various industries. This inorganic compound is characterized by its white powdery appearance, which lends itself well t...
... Description ●SI8230 is two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to deep layer in room temperature. The operation time can be adjus...
...consists of reservoir, pump, sample injector, chromatographic column, detector and recorder. And it is mainly used to analyze less-volatile and thermal-unstable organic compounds with high boiling point and ...
... injector, chromatographic column, detector and recorder, which is an instrument based on the principle of high performance liquid chromatography. It is used to analyze less-volatile and thermal-unstable org...
... with the characteristics of high operation stability, high detection sensitivity and modular designing. It is mainly used to analyze less-volatile and thermal-unstable organic compounds with high boiling po...
... based on the principle of high performance liquid chromatography, which is mainly used to analyze less-volatile and thermal-unstable organic compounds with high boiling point and large molecular weight. It ...