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WDS-620 Optical Alignment BGA Rework Station heating picking up bonding the chip Higher automatic function Newest WDS-620 is the updated system with 5 modes.Its Remove,Mount,Weld,Manual and Semi-auto.The mode ...
WDS-900 BGA rework machine specification: 1,Model: WDS-900 2,Max PCB size:W760*D630mm 3,PCB thickness:0.58mm 4,suit chips size:1*1120*120mm 5,Applicable chip minimum spacing:0.15mm 6,Mount the maximum load: 1...
... us know. we are pleased to quote you our best price . Thank you ! SAL-TC277TP-64F200N is a microcontroller chip manufactured by Infineon Technologies AG. It is a member of the TriCore™ family of microcontro...
... Logic Devices BGA-68 Our Electronic IC Chips are 100% Original Brand New, and come in a variety of packages including DIP, SOP, QFP, QFN, and BGA. With a wide range of voltage options from 3.3V, 5V, and 12V...
... characteristics: 1. High brightness LED lamp shadowless lighting, check the motherboard chip at a glance bad; 2. Breeze adjustment function, according to the chip size to adjust different wind speed, repair...
Description: Graphics chip BGA 900IGP RC300MB 216CBS3AGA21H GPU chip ATI Computer IC Chips 216CBS3AGA21H is a GPU chip . Place of Origin: TAIWAN Brand Name: ATI Model Number: 216CBS3AGA21H Type: integrated circ...
5CGXFC5C6F23C7N Field Programmable Gate Array FPGA IC Chip BGA List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND MAX2090ETP+T MAXIM PALCE22V10H-5JC/5 AMD ......
AR9344-DC3A BGA integrated circuit Wifi IC Chip Atheros List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND XC6219F122PR-G TOREX TMS320DVC5416GGU TI ......
...BGA Package Product Description Of ADSP-SC587W ADSP-SC587W is Dual enhanced SHARC+ high performance floating-point cores. ADSP-SC587W Large on-chip L2 SRAM with ECC protection, up to 256 kB On-chip L2 ROM (5...
...Chip APL109C/343S00554 Iphone Macbook AIR/Performance Manager IC Product Description Of APL109C/343S00554 APL109C/343S00554 is Iphone ic chip,Iphone Macbook AIR/performance manager IC.Package is BGA. Specifi...
...) package, and is suitable for applications such as telecommunication, storage, and data processing. Features: • 324-pin BGA package • 28K logic elements • Up to 18,432 Kbits of embedded memory • Up to 576Kb...
...Chip Field Programmable Gate Array (FPGA) IC 224 2002944 25000 Package 484-BGA Number of LABs/CLBs 9434 Number of Logic Elements/Cells 25000 Total RAM Bits 2002944 Number of I/O 224 Voltage - Supply 1.07V ~ ...
...Chip Package 400-BGA Voltage Supply 1.14V ~ 1.26V Number of LABs/CLBs 896 Number of Logic Elements/Cells 8064 Total RAM Bits 368640 Number of I/O 311 Number of Gates 400000 Voltage - Supply 1.14V ~ 1.26V Mou...
...Chip Package 400-BGA Voltage Supply 1.14V ~ 1.26V Number of LABs/CLBs 896 Number of Logic Elements/Cells 8064 Total RAM Bits 368640 Number of I/O 311 Number of Gates 400000 Voltage - Supply 1.14V ~ 1.26V Mou...
5CGXFC5C6F23C7N Field Programmable Gate Array FPGA IC Chip BGA List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND MAX2090ETP+T MAXIM PALCE22V10H-5JC/5 AMD ......
AR9344-DC3A BGA integrated circuit Wifi IC Chip Atheros List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND XC6219F122PR-G TOREX TMS320DVC5416GGU TI S553104DWEY4C FREESC...
... transceiver integrated into a single monolithic CMOS chip. Specification Of BCM89883B1BFBG Part Number: BCM89883B1BFBG Package: BGA Port: Single-Port Type: Single Monolithic CMOS Chip Interface: SGMII MAC I...
IMBF170R450M1XTMA1 Integrated Chips Best Selling Integrated Circuits Ic BGA Product Description Fully controllable dV/dt, optimized for EMI Compatible with flyback controllers with 12 V / 0 V gate source voltag...
MPC5554MZP132 BGA Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching perfo...
...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside ...