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... high thermally conductivity and reduces the weight more than 30% comparing with the same aluminium devices. Application TCP™100-30-06A can be used in applications such as Heat Sinking ......
...housing design which requires high thermally conductivity and reduces the weight more than 30% comparing with the same aluminium devices. Application TCP™100-25-06A can be used in applications such as Heat S...
...Lamps Black Thermal Conductive Plastic Housing 5 W / mK with 1.45g / cm Specific Gravity TCP™200-50-01A is a Thermally Conductive Engineering Plastic developed for the housing design which requires high ther...
...Conductive Pad For Automotive Engine Control Units Products description The TIF800QE Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant tog...
... thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, ......
... adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal im...
...Heat Sinking Thermal Conductive Plastic TCP 100-01PP , 1 W-mK , RoHs and UL 1.55g/cm3, 94V0 TCP 100-01PP is a Thermally Conductive Engineering Plastic developed for the housing design which requires high th...
High thermal conductivity 4W thermal conductive pad silicone heat transfer gap filler TIF100-40-06E Ziitek Electronic Material and Technology Ltd. is dedicated to developing ......
...conductive pad silicone soft sheet 2W/mK for IC components Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal c...
... thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. ...
Application In Electronic Parts High Thermal Conductivity 3w Thermal Conductive Silicone Pad The TIF140-30-15ESeries is recommended for applications that require a minimum amount of pressure on components. The ...
1mmT High Quality And High Conductivity 3w Green Silicone Thermal Conductive Pad For Advanced Cooling Needs The TIF140-30-05S Series is not only designed to take advantage of the gap heat transfer, to fill gap...
... thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. ...
...Conductive Pad TIF180-30-01E 2mm Thickness 3W/MK ROHS And UL The TIF™180-30-01E is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product ha...
... continuously developing economic and social needs. The TIF180-31S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture...
...Conductive Silicon Pad For Monitoring The Power Box The TIF™160-15-27E is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hard...
... Cured Thermally Conductive Silicone Adhesive For LED Lamps And Power-Driven Potting TIS™580-10 Series is dealcoholized,one component, room temperature cure thermally conductive silicone adhesive. lt possess...
... This product is a two-layer structure,the outer layer is conductive PE membrane with the Anti-static value of 10^7~10^11Ω,and the Conductor value is 10^4~10^6Ω The air bubbles can prevent ......
... This product is a two-layer structure,the outer layer is conductive PE membrane with the Anti-static value of 10^7~10^11Ω,and the Conductor value is 10^4~10^6Ω The air bubbles can prevent ......
... This product is a two-layer structure,the outer layer is conductive PE membrane with the Anti-static value of 10^7~10^11Ω,and the Conductor value is 10^4~10^6Ω The air bubbles can prevent ......