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... resistance (DCR). They operate within a wide temperature range of -40 to +125, making them suitable for demanding applications such as Buck converters, VRMs, DDR memory, and output chokes in high-density ci...
...low core loss, high current capability, and low DC resistance (DCR). They are suitable for use in Buck converters, VRMs, DDR memory, high-density PCB designs, and as output chokes in server VRMs and switchin...
BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/w...