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... to generate a very stable low noise signal for controlling the local oscillator of an RF transceiver. They are fabricated using National’s ABiC V silicon BiCMOS 0.5µ process. The LMX2306 contains a 8/9 dual...
...Low-alloy High-strength Steel Coil Chemical Composition and Mechanical Property Element Content (%) Iron, Fe 97 Nickel, Ni 0.85 Manganese, Mn 0.8 Molybdenum, Mo 0.5 Chromium, Cr 0.48 Copper, Cu 0.33 Silicon,...
...Low-alloy High-strength Steel Coil Chemical Composition and Mechanical Property Element Content (%) Iron, Fe 97 Nickel, Ni 0.85 Manganese, Mn 0.8 Molybdenum, Mo 0.5 Chromium, Cr 0.48 Copper, Cu 0.33 Silicon,...
6006Ce Ceramic Ball Bearings Usage:ball bearing for high precision, anti-corrosion, vacuum, nonmagnetic, high temp, low temp, electric insulation. Characteristic: resistance to strong acid, strong alkali, salt ...
..., and general type of one component moisture curable sealant. Curing material combines the advantages of polyurethane and silicone adhesive sealant products, is a new generation of. The operating period is l...
..., and general type of one component moisture curable sealant. Curing material combines the advantages of polyurethane and silicone adhesive sealant products, is a new generation of. The operating period is l...
1.5 W/mK Blue LED Thermal Gap Pad Easy With Heat Sink LED Lighting COB CPU GPU TIF100-05S Datasheet-REV02.pdf The TIF140--15-5S Series ) is an extremely soft gap filling material rated at a thermal conductivity...
...polyurethane and silicone adhesive sealant products, is a new generation of. The operating period is long, low modulus, without bottom coating, curing, paintable with high elasticity, resistance to ultraviol...
..., low viscosity, and general type of one component moisture curable sealant. Curing material combines the advantages of polyurethane and silicone adhesive sealant products, is a new generation of. The operat...
...Silicon Nitride (Si3N4) Ceramics is a high-performance material, offering excellent mechanical properties, such as Young's Modulus of 300-400 GPa, Thermal Expansion Coefficient of 3.2-3.5 X 10-6/K, Flexural ...
...Low Stress Applications Silicone Pads for LED Controller The TIF120-20-10UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low...
...silicone rubber, for Telecommunication hardware,-40 to 160℃,2.5 g/cc The TIF1200-18-01US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This pr...
...silicone rubber 3.0 W/m-K,-40 to 160℃ The TIF120-30-06US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conf...
...Silicone Pad For Electronics Cooling The TIF160-20-19F is an extremely soft gap filling material rated at a thermal conductivity of 2.0W/m-K. It is specially formulated for high performance applications requ...
...Low Stress Applications Conductive Pads for CD-Rom The TIF1120-20-10UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hard...
...additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. ...
Product description SMP Sealant for constrction is a low or mid modulus, neutral, elastic, single component sealant, which has many applications including joint or crack sealing in building interior decoration,...
...30-01E is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modu...
... additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling ...