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... 90/120 4.6A 42-45V 40X55MM 34MM 120 95 Mirror copper-aluminum combined substrate Cob Chip FAQ: Q1: Do you supply OEM,ODM service? A1: YES,absolutely it can be realized.Learnew focus on OEM & ODM service mor...
... 90/120 4.6A 42-45V 40X55MM 34MM 120 95 Mirror copper-aluminum combined substrate Cob Chip FAQ: Q1: Do you supply OEM,ODM service? A1: YES,absolutely it can be realized.Learnew focus on OEM & ODM service mor...
...Chips Cct 620nm/460nm/520nm/2700k /6500k Emit Size 32mm Cri 95 Product Details COBE POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI 4050 SERIES 180W Five color COB 620nm/460nm/520nm/2700K /6500K 90...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
... ANGLE CRI SUBSTRATE 2424SERIES 40W+40WBi Color LED Chip 2800K/6500K 100/110 1100MA 36V-38V 24X24MM 21MM 120 95 Mirror copper-aluminum combined substrate Two-color COB (Chip-on-Board) LED lamps have many adv...
...electrical separation copper substrate + aluminum nitride structure COB (Chip on Board) LED is an LED packaging technology that directly connects LED chips to the PCB substrate instead of using traditional L...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
...-110LM/W 2.7A 36-39V 38*56 32MM 120° 95 Copper + aluminum nitride1.6T Differences between COB chips and traditional chips Packaging form: COB chips are directly exposed on the circuit...
...-110LM/W 2.7A 36-39V 38*56 32MM 120° 95 Copper + aluminum nitride1.6T Differences between COB chips and traditional chips Packaging form: COB chips are directly exposed on the circuit...
...-110LM/W 2.7A 36-39V 38*56 32MM 120° 95 Copper + aluminum nitride1.6T Differences between COB chips and traditional chips Packaging form: COB chips are directly exposed on the circuit...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
... CRI SUBSTRATE 2424SERIES 40W+40W Bi Color LED Chip 2800K/6500K 100/110 1100MA 36V-38V 24X24MM 21MM 120 95 Mirror copper-aluminum combined substrate Two-color COB (Chip-on-Board) LED lamps have many advantag...
...chip for plant growing light Product Description PRODUCT NAME: plant grow lights SMD LED CHIP 3030 POWER DISSIPATION: 0.5W;1W DOMINANT WAVELENGTH: 650-660nm;support custom CIRCUIT: 1PCS in series;1PCS in par...
...: 1PCS in series;1PCS in parallel WHOLE SIZE: 3.0*3.0MM DESIGN ADVANTAGE: 1,PCT leadframe for better heat transfer. 2,Standard A Class chips. 3,Cost performance. 4...