Gold Tin Alloy Solder Preforms High Melting Point Solder
Product Description
Gold-tin alloy is a kind of electronic welding, which has a very
good market and prospects. Gold-tin alloy using gold-tin alloy
solder in electronic applications Gold-tin alloy is produced by
brazing technology and is an important technology for assembling
electronic products. In order to obtain an ideal brazed connection,
the choice of brazing material is crucial. The solderability,
melting point, strength and Young's modulus, thermal expansion
coefficient, thermal fatigue, creep and creep resistance of the
brazing material can all affect the quality of the brazed
connection.
Eutectic gold 80% tin 20% brazing alloys (melting point 280°C) have
been used for many years in the semiconductor and other industries.
Due to its excellent physical properties, gold-tin alloy has
gradually become the best brazing material for optoelectronic
device packaging
| Material name | solidus℃ | liquidus℃ | Recommended Soldering Temperature℃ | densityg/cm³ | Thermal conductivityW/m.℃ | Tensile Strength(MPa) |
| Au80Sn20 | 280 | 280 | ＞310 | 14.51 | 57 | 276 |
Gold-tin alloy is a binary alloy of gold and tin, with a eutectic
temperature of 278°C and a concentration of 30% Sn. Alloys such as
AuSn20, AuSn27 and AuSn90 have high thermal conductivity, low vapor
pressure, excellent corrosion resistance, good wettability and
fluidity. It is manufactured by the "hot composite-cold rolling"
process, which can roll foils of 0.05 to 0.1 mm. Gold-tin alloys
are used for brazing of gold-plated or gold-plated alloy lead
frames and leads. Adding (50-300) × 10-6 platinum and/or palladium
new brazing filler metal to AuSn20 alloy has the effect of
inhibiting the excessive diffusion and random flow of the brazing
filler metal and improving the brazing effect.
Product display
Advantages of Au-Sn Solder
1. Moderate brazing temperature
The brazing temperature is only 20-30°C higher than its melting
point (ie, about 300-310°C). During the brazing process, based on
the eutectic composition of the alloy, a small degree of superheat
can melt and infiltrate the alloy; the solidification process of
the alloy is very fast. Therefore, the use of gold-tin alloys can
greatly shorten the entire brazing process. The brazing temperature
range of gold-tin alloys is suitable for component assembly that
requires high stability. At the same time, these components can
also withstand subsequent assembly using lead-free solder at
relatively lower temperatures. The assembly temperature of these
solders is around 260°C. Eutectic gold-tin solder (Au80Sn20) offers
a temperature operating range up to 200°C.
2. High strength
The yield strength of gold-tin alloy is very high, and its strength
can meet the requirements of air tightness even at a temperature of
250-260 °C.
3. No flux required
Gold accounts for a large proportion (80%) in the alloy
composition, and the degree of oxidation on the surface of the
material is low. The use of chemical fluxes is not necessary if a
vacuum or a reducing gas such as a mixture of nitrogen and hydrogen
is used in the brazing process. This is one of the most striking
features and is most important for electronics, especially
optoelectronic device packaging.
4. Infiltration
Has good wettability and corrosion of lead-free tin solder on the
gold-plated layer. The composition of the gold-tin alloy is close
to that of the gold-plated layer, so the degree of infiltration of
very thin layers by diffusion is very low, and there is no
migration phenomenon like silver.
5. Low viscosity
Liquid gold-tin alloys have very low viscosity, which allows them
to fill some large voids. No liquidity in most cases.
6. Au80%Sn20% solder has high corrosion resistance, high creep
resistance and good thermal and electrical conductivity, and the
thermal conductivity reaches 57 W/m·K.
7. Lead-free.
8. Form temperature steps with low melting solder.
AuSn alloys have important applications in laser encapsulation in
optoelectronics. Gold-tin alloy will be an important packaging
material for the promotion of optical communication and photonic
computers in the next five years.
Packaging and Shipping
Product packaging usually depends on the size and shape of the
product selected by the customer. We currently have several main
packaging methods:
1. VR box; 2. Bottled; 3. Reel; 4. Blue film; 5. Tape etc.
FAQ
1.Are you trading or manufacturer ?
We are company,and we have our own factory
2.How long is your delivery time?
| Quantity(kilograms) | 1 - 500 | >500 |
| Est. Time(days) | 10 | To be negotiated |
3.Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the
cost of freight.
If you have another question, pls feel free to contact us
