2 W / M * K Thermal Gap Filler Pads For Lithium Battery Pack
Cooling Plate
Discription of Thermal Gap Filler Pads:
Thermal Gap Filler Pads is generally located between the liquid cooling plate and the cell
pole, which can effectively exclude air and achieve good filling
and Thermal Gap Filler Pads effects. In addition, it also has good insulation and voltage
resistance characteristics and temperature stability, safe and
reliable use. Thermal Gap Filler Pads are also widely used in communication equipment, network terminals, data transmission, LED, automotive electronics, consumer
electronics, medical devices, military, aerospace and other fields.
In the industry, Thermal Gap Filler Pads also known as thermal silicone pad, thermal silicon film, soft
thermal pad, thermal silicone gasket, etc., is specially produced
for the design of using the gap to transfer heat, which can fill
the gap and complete the heat transfer between the heating part and
the heat dissipation part;
Technological Parameters:
| Thermal Gap Filler Pads Series |
| Item No. | Thermal Conductivity (W/m*K)
| Hardness (Shore 00) | Density (g/cc) | Voltage Resistance (KV/MM) | Volume Resistivity (Ω*cm) | Flame Rating (UL-94) |
| 301-0150 | 1.5 | 5~80 | 1.8 | 10 | 10^12 | V0 |
| 301-0200 | 2 | 5~80 | 2 | 10 | 10^12 | V0 |
| 301-0300 | 3 | 15~80 | 3.0 | 8 | 10^12 | V0 |
| 301-0400 | 4 | 15~80 | 3.3 | 8 | 10^12 | V0 |
| 301-0600 | 6 | 20~80 | 3.5 | 8 | 10^12 | V0 |
| 301-0800 | 8 | 30~80 | 3.6 | 8 | 10^12 | V0 |
| 301-1000 | 10 | 30~80 | 3.3 | 6 | 10^12 | V0 |
| 301-1200 | 12 | 30~80 | 3.2 | 6 | 10^12 | V0 |
Application of Thermal Gap Filler Pads:
Thermal Gap Filler Pads It is mainly used for control motherboards
of electronic and electrical products, foot pads and pads inside
and outside of motors, electronic and electrical appliances,
automotive machinery, computer hosts, laptops, DVDS, VCDS and any
materials that need to be filled and cooling modules.
Advantages of Thermal Gap Filler Pads:
1, The main purpose of the selection of Thermal Gap Filler Pads to reduce the contact thermal resistance between the surface of the
heat source and the contact surface of the heat dissipation device, Thermal Gap Filler Pads can fill the gap of the contact surface well;
2, The air is a bad conductor of heat will seriously hinder the
transfer of heat between the contact surface, and the heat transfer Thermal Gap Filler Pads between the heat source and the radiator can squeeze the air out of
the contact surface;
3, With the supplement of heat-conducting Thermal Gap Filler Pads , can make the contact surface between the heat source and the
radiator better and full contact, really face-to-face contact, so
that the reaction on the temperature can be as small as possible.
FAQ
A)How could I get a sample?
Before we received the first order, please afford the sample cost
and express fee. We will return the sample cost back to you within
your first order.
B)Sample time?
Within 10-30 days.
C) Whether you could make our brand on your products?
Yes. We can print your Logo on both the thermal gap Filler Pads and the packages if you can meet our MOQ.
D) Whether you could make your products by our color?
Yes, The color of products can be customized if you can meet our
MOQ.
E) How to guarantee the quality of Thermal Gap Filler Pads ?
1) Strict detection during production.
2) Strict sampling inspection on products before shipment and
intact product packaging ensured.
F) : Do you accept R & D assignments?
Yes, as long as we can do products, we can according to Your Design
Requirements of individual R & D.
