This 2-layer rigid high-frequency PCB features aerospace-grade
F4BTMS265 ceramic-filled dielectric substrate with low
electromagnetic loss and minimal anisotropy. It adopts ENIG surface
treatment, black top solder mask and white top silkscreen, with a
fully mask-free and silkscreen-free bottom side. All units pass
100% electrical testing before delivery, ensuring stable dielectric
performance, low signal attenuation and reliable structure for
aerospace, military and RF/microwave applications.
PCB Specifications
| Parameter Item | Specification |
| Base Material | F4BTMS265 upgraded ceramic-filled high-frequency substrate |
| Layer Configuration | 2-layer rigid PCB structure |
| Board Dimension | 97mm × 76mm (1 piece), dimensional tolerance: ±0.15mm |
| Minimum Trace / Space | 14 mils / 14 mils |
| Minimum Mechanical Hole Diameter | 0.25mm |
| Via Type | Pure through-hole vias, no blind vias |
| Finished Board Thickness | 0.85mm |
| Outer Copper Weight | 1oz (1.4 mils) outer copper layer |
| Via Plating Thickness | 20μm |
| Surface Finishing | ENIG (Electroless Nickel Immersion Gold) |
| Top Silkscreen | White silkscreen |
| Bottom Silkscreen | Silkscreen-free |
| Top Solder Mask | Black solder mask |
| Bottom Solder Mask | Solder mask-free |
| Quality Inspection | 100% full electrical testing performed prior to delivery |
PCB Layer Stack-up Structure
| Layer Definition | Technical Specification |
| Top Copper Layer | 35μm finished copper thickness |
| Dielectric Core Substrate | F4BTMS265 core, 0.762mm (30mil) thickness |
| Bottom Copper Layer | 35μm finished copper thickness |
Artwork & Quality Compliance
Production File Standard: Fabricated based on industry-standard
Gerber RS-274-X files, supporting high-precision circuit patterning
and full compatibility with mainstream industrial manufacturing
processes.
Quality Standard: All fabrication and inspection procedures comply
strictly with IPC-Class-2 specifications, ensuring stable
electrical performance and long-term structural reliability.
Global Availability: Worldwide supply and logistics services are
available to support global aerospace and high-frequency electronic
projects.
F4BTMS265 Material Profile
F4BTMS265 is an upgraded high-reliability ceramic-reinforced PTFE
dielectric substrate optimized from the standard F4BTM series. Filled with uniformly distributed nano-ceramic particles
and ultra-fine glass fiber, it reduces glass fiber-caused
electromagnetic interference, dielectric loss and structural
anisotropy. Adopting low-roughness RTF copper foil as standard, it
delivers low conductor loss and stable peel strength, and supports
copper/aluminum base lamination. With excellent dimensional,
thermal and dielectric stability, this aerospace-grade material
serves as a high-performance substitute for imported high-frequency
substrates in military and aerospace applications.
Typical Application Fields
Featuring ultra-low dielectric loss, minimal structural anisotropy,
superior thermal stability and aerospace-grade reliability,
F4BTMS265-based PCBs are well-suited for deployment in
high-precision, phase-sensitive high-frequency electronic systems:
- Aerospace devices, space equipment and cabin electronic systems
- High-frequency RF and microwave circuit systems
- High-precision military radar equipment
- Antenna feed network components
- Phase-sensitive antennas and phased array antenna systems
- Satellite communication systems
