We're excited to introduce a high-performance 3-layer PCB
constructed with advanced F4BM265 material. This PCB is
specifically engineered to meet the rigorous demands of various
high-frequency applications, ensuring exceptional reliability and
performance.
PCB Construction
This PCB is characterized by the following key construction
features:
- Material: F4BM265
- Layers: Comprises 3 layers
- Dimensions: Measures 168mm x 168mm, with a tolerance of ±0.15mm
- Trace and Space: Minimum of 6/8 mils
- Hole Size: Minimum diameter of 0.4mm
- Blind Vias: No
- Thickness: Finished board thickness of 6.2mm
- Copper Weight: 1 oz (1.4 mils) for both inner and outer layers
- Via Plating: Thickness of 20 μm
- Surface Finish: Bare copper
- Silkscreen: No
- Solder Mask: No
- Testing: Undergoes 100% electrical testing prior to shipment
These specifications are engineered to deliver exceptional
performance and reliability across various applications.
PCB Stackup Configuration
This PCB features a robust stackup that includes a 2-layer rigid
design. The configuration consists of:
Copper_layer_1 - 35 μm
F4BM265 Core - 3.0 mm (118mil)
Copper_layer_2 - 35 μm
Bonding Ply-
F4BM265 Core - 3.0 mm (118mil)
Copper_layer_3 - 35 μm
This structure is engineered to provide excellent electrical
performance and thermal management, essential for high-frequency
applications.
Artwork and Quality Standards
The artwork supplied for this PCB follows the Gerber RS-274-X
format, allowing for precise manufacturing and assembly. Adhering
to IPC-Class-2 quality standards, each board is produced to meet
rigorous industry requirements, ensuring reliability for various
applications.
Introduction to F4BM265
The F4BM series laminates are formulated by scientifically
combining fiberglass cloth, polytetrafluoroethylene resin, and PTFE
film. Compared to the previous F4B material, F4BM265 delivers
improved electrical performance, characterized by a wider range of
dielectric constants, reduced dielectric loss, increased insulation
resistance, and enhanced stability. This material can effectively
replace similar foreign products.
The F4BM and F4BME variants share the same dielectric layer but
differ in copper foil combinations. F4BM is designed with
electrodynamic (ED) copper foil, making it suitable for
applications that do not require passive intermodulation (PIM)
performance. In contrast, F4BME utilizes reverse-treated foil
(RTF), providing superior PIM characteristics, more precise line
control, and lower conductor loss.
Features of F4BM265
The F4BM265 material offers several key features that enhance its
usability:
Dielectric Constant (Dk): 2.65 ±0.05 at 10 GHz
Dissipation Factor: 0.0013 at 10 GHz, 0.0018 at 20 GHz
Temperature Coefficient of Dielectric Constant (TCDK): -100 ppm/°C
(temperature range: -55°C to 150°C)
CTE (Coefficient of Thermal Expansion):
X-axis: 14 ppm/°C
Y-axis: 17 ppm/°C
Z-axis: 142 ppm/°C (temperature range: -55°C to 288°C)
Thermal Conductivity: 0.36 W/mk
Moisture Absorption: 0.08%
These features make the F4BM265 material particularly suitable for
high-frequency applications, ensuring low loss and enhanced
dimensional stability.
Typical Applications
This PCB is well-suited for a variety of applications, including:
Microwave, RF, and Radar Systems: Ideal for high-frequency
communication devices.
Phase Shifters and Passive Components: Essential for efficient
signal processing.
Power Dividers, Couplers, and Combiners: Critical for effective
signal distribution.
Feed Networks and Phased Array Antennas: Vital for advanced radar
and satellite communications.
Satellite Communications: Supports a range of communication
technologies.
Base Station Antennas: Integral to mobile and wireless
communication infrastructure.
Conclusion
With its durable construction, superior electrical performance, and
versatility, this PCB is poised to meet the evolving demands of
industries reliant on high-frequency circuit boards.
For more details or to place an order, please reach out to our
sales team. We look forward to collaborating with you.
