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HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB

    Buy cheap HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB from wholesalers
     
    Buy cheap HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB from wholesalers
    • Buy cheap HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB from wholesalers
    • Buy cheap HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB from wholesalers
    • Buy cheap HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB from wholesalers
    • Buy cheap HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB from wholesalers
    • Buy cheap HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB from wholesalers

    HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB

    Ask Lasest Price
    Brand Name : WITGAIN PCB
    Model Number : S04F4726A0
    Certification : UL Certificate
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 500kpcs/month
    Delivery Time : 15 work days
    • Product Details
    • Company Profile

    HASL 3.5MM Double Layer FR4 3OZ Thick Copper PCB

    2 Layer Thick Copper PCB


    PCB Specifications:


    Layer Count: 2 Layer PCB

    Material: FR4, IT180A

    Board Thickness: 3.5MM

    Min Hole: 0.3MM

    Min Trace: 20/10Mil

    Copper: 3/3OZ

    Solder Mas: Green

    Unit Size: 165MM*144MM/1pcs

    Surface Treatment: HASL

    Application: Power Supply


    Capabilities:


    ItemCapability
    Layer Count1-24 Layers
    Board Thickness0.1mm-6.0mm
    Finished Board Max Size700mm* 800mm
    Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
    Warp<0.7%
    Major CCL BrandKB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter0.1mm-6.5mm
    Out Layer Copper Thickness1/20Z-8OZ ;
    Inner Layer Copper Thickness1/3OZ-6OZ
    Aspect Ratio10:1
    PTH Hole Tolerance+/-3mil
    NPTH Hole Tolerance+/-1mil
    Copper Thickness Of PTH Wall>10mil(25um)
    Line Width And Space2/2mil
    Min Solder Mask Bridge2.5mil
    Solder Mask Alignment Tolerance+/-2mil
    Dimension Tolerance+/-4mil
    Max Gold Thickness200u'(0.2mil)
    Thermal Shock288C, 10s, 3 Times
    Impedance Contro+/-10%
    LTest CapabilityPAD Size Min 0.1mm
    Min BGA7mil
    Surface TreatmentOSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable


    FAQ:


    Question: What is Loss Tangent?

    Answer: In PCBs, Loss tangent (tan (δ)) is the measure of signal loss due to the inherent dissipation of electromagnetic energy in the substrate of the printed circuit board. It is a dimensionless quantity and generally referred to: Loss Factor, Tan δ, Dissipation factor and Loss angle.

    All PCB materials have both conduction losses and dielectric losses. The conduction losses are resistive and are caused by the conductive copper layer used in the board. The dielectric losses on the other hand are associated with the substrate (insulating material) used in a PCB. When the electric field is applied, polarization occurs and charges are displaced relative to the electric field. Dielectric losses cause a reduction in the overall electric field.

    The total amount of polarization that can occur in a dielectric depends upon the molecular symmetry of the insulator material and is called Dipole Moment. The effect of the dipole moment in a dielectric substrate is termed Loss Tangent.

    Mathematically, the loss tangent is the phase angle between the resistive and reactive components of a system with permittivity. A low value of loss tangents results in a "fast" substrate while large value results in a "slow" substrate.

    The formula for Loss Tangent or the Dissipation Factor is:

    where δ is the loss angle, θ is the phase angle, f is the frequency, Rp is the equivalent parallel resistance, and Cp is the equivalent parallel capacitance.

    The signal loss by the dielectric material depends upon the material’s structure and glass-resin composition. Selection of low loss materials is the major task for manufacturers that is why they are advised to plot the attenuation equation against frequency for various material choices.

    Loss tangent plays a crucial factor for very high frequencies above 1 GHz and analog signals to determine the signal attenuation.


    Quesion: What is the Solder Mask?

    Answer: Solder mask or solder resist is a coating applied to a Printed Circuit Board (PCB) to protect the copper traces on the board and to stop electrical shorts. The solder mask is usually applied on both sides of the PCB i.e Top and Bottom to ensure reliability and performance.

    The solder mask is a Liquid UV Photo-imageable Ink which is usually green in color. Other color options like red, blue, yellow, white, black and purple are also available. This is something you need to ask your PCB fabricator.

    Solder mask and solder mask swell

    In the image above, the light green line is the solder mask layer. As you can see, the solder mask covers the entire trace, leaving only the pads exposed which are required to make electrical connections.

    What is the purpose of using a solder mask?

    • To prevent short circuits and protect the copper traces on the board.
    • To protects the traces from exposure to air which can cause oxidation and corrosion of traces.

    What material is used for solder mask?

    Resin is usually selected as the main material for solder mask because it works exceptionally well in terms of humidity resistance, insulation, solder resistance and high-temperature resistance.

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