Light Weight And Tailored Thermal Conductivity Molybdenum Copper
Heat Transfer For Sensitive Electronic Components
Description:
With technology development, there are more need for higher power
in smaller microelectronics components. This also increase the
requirements for heat dissipation.
For sensitive components, to use metal composite like molybdenum
copper material is a wise choice.
What we can:
For moly copper, we offer sheet or plate to customers. Customers
will use it to fabricate different parts.
To reach a good plating and welding effect, we will offer good
surface for the application.
If customers directly use it in high power amplifiers, we can offer
plated parts based on the drawings.
The grade we can offer: 85MoCu, 80MoCu, 70MoCu, 60MoCu, 50MoCu.
Product Properties:
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat sinks are widely used in applications such
as microwave carriers, ceramic substrate carriers, laser diode
mounts, optical packages, power packages, butterfly packages and
crystal carriers for solid state lasers, etc.
