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Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors

    Buy cheap Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors from wholesalers
     
    Buy cheap Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors from wholesalers
    • Buy cheap Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors from wholesalers

    Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors

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    Brand Name : JBNR
    Model Number : HCMC013
    Certification : ISO9001
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 5 tons a month
    Delivery Time : 20 days
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    Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors


    Ultra-pure Low Density Heat Dissipating Mo/cu Laminates In High-power Transistors


    Description:

    Consisting of ultra-pure molybdenum with OFC in 30% weight,molybdenum copper composite has the properties of higher thermal conductivity and lower density compared with pure molybdenum. Nowadays the electronic components is getting smaller and also requires greater power densities.

    By using our moly copper carriers, you could receive efficent cooling effect and outstanding service life.


    What we can offer:

    1. With years of powder metalurgy experience, we can make very even grain size. And the material has no pores in inner structure.

    This can ensure the material has good hermeticity.

    2. For different materials, we have ways of surface dealing to make sure the surface is good for your own plating.

    3. We can offer all kinds of plating, including nickel plating, gold plating or Ag plating. If you wanna your carriers to be plated, you can let us know.


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)


    Application:

    Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

    Product Tags:

    mocu heat sink

      

    mocu

      
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