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HDI Board Prototype Pcb Fabrication High Tg FR4 12 SMT Pcb Manufacturer

    Buy cheap HDI Board Prototype Pcb Fabrication High Tg FR4 12 SMT Pcb Manufacturer from wholesalers
     
    Buy cheap HDI Board Prototype Pcb Fabrication High Tg FR4 12 SMT Pcb Manufacturer from wholesalers
    • Buy cheap HDI Board Prototype Pcb Fabrication High Tg FR4 12 SMT Pcb Manufacturer from wholesalers

    HDI Board Prototype Pcb Fabrication High Tg FR4 12 SMT Pcb Manufacturer

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    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 100000pc/Month
    Delivery Time : 4 Weeks
    Brand Name : CUSTOM MADE
    Certification : ISO/UL
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    • Company Profile

    HDI Board Prototype Pcb Fabrication High Tg FR4 12 SMT Pcb Manufacturer

    Printed Circuit Board Fabrication HDI Board High - Tg FR4 12 SMT Lines


    Printed Circuit Board Fabrication Description:

    1. A team of experts with more than 10 years of experience.
    2. Professional component certified engineers and experienced supply chain management team.
    3. Pay attention to the latest international market information and provide competitive prices.
    4. Certified suppliers and parts.


    Printed Circuit Board Fabrication Parameters:

    Layer2-64
    Thickness0.3-6.5mm
    Copper Thickness0.3-12 oz
    Min Mechanical Hole0.1mm
    Min Laser Hole0.075mm
    HDI1+n+1,2+n+2,3+n+3
    Max Aspect Ratio20:01
    Max Board Size650mm*1130mm
    Min Width/Space2.4/2.4mil
    Min Outline Tolerance±0.1mm
    Impedance Tolerance±5%
    Min PP Thickness0.06mm
    Bow &Twist≤0.5%
    MaterialsFR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
    Surface FinishedHASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
    Special CapabilityGold Finger Plating, Peelable, Carbon ink

    Printed Circuit Board Fabrication Introduction:

    The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.


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