Black ABS Waffle Pack Chip Tray for Optical Device
The Waffle Pack is widely used in semiconductor, photoelectric
industry. The product requires a high degree of cleanliness and
size. From the design drawings, mold manufacturing, product
manufacturing to cleaning packing , all of the steps and operations
through strict quality control. To deliver the ultimate goal of
customer satisfaction for product, our company continuously meet
the customer's requirements and promote our factory to a higher
level of progress.
1.Details about The HN21093 Black ABS Waffle Pack Chip Tray for
Optical Device
The HN21093 Waffle Pack is a tray made of industrial plastics. The
raw material can be recycled, and it is easy to be degraded after
waste. There is no concern about environmental protection. It is small in size, light in weight and low in transportation
cost.
At the same time, the 20*20 matrix can hold a large number of
products, which is suitable for transfer or loading sample testing.
The Hiner-pack also produces covers and clamps ,which are suitable
for fastening and transporting all kinds of waffle packs.
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN21093 | Package Type | Bare Die |
| Cavity Size | 0.95*1.25*0.46 | Matrix QTY | 20*20=400PCS |
| Material | ABS | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
2.Product Application
Optical device packaging Electrical equipment and systems
Electronic component packaging Wafer Die / Bare / Chips
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
3.Advantages
1. Flexible OEM service: we can produce products according to
customer’s sample or design.
2. Various Materials: the material can be
MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection
molding,Production.
4. Comprehensive customer service: from customer consultation to
after sales service.
5. 10 years experience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level
and produce products quickly and flexibly.
4.FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years
with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you
according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we
can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee
should be paid by yourself.
