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Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

    Buy cheap Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices from wholesalers
     
    Buy cheap Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices from wholesalers
    • Buy cheap Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices from wholesalers
    • Buy cheap Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices from wholesalers

    Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

    Ask Lasest Price
    Brand Name : Forewell
    Model Number : CMLO0520H
    Certification : ISO9001,ISO14001
    Price : Negotiate
    Payment Terms : T/T
    Supply Ability : 1000000 pcs per lot
    Delivery Time : 3-21days
    • Product Details
    • Company Profile

    Alloy Powder Chip Power Inductor Drum Core 0.68uH For Mobile Devices

    SMD Alloy Powder Molded Chip Power Inductor Drum Core Fixed Inductor For Mobile Devices 0.68uH~10uH

    SMD Power Inductor Original Smd Alloy Powder Molded Chip Integrated Circuit Ic 1.0uH~4.7uH


    Features:

    • Magnetically shielded construction, low DC resistance;
    • The use of magnetic iron powder ensure capability for large current;
    • Low audible core noise;
    • Ideal for DC-DC converter applications in hand held personal computer and etc;
    • Frequency Range: up to 29MHz;
    • RoHS compliant
    • Reliable quality

    Applications:

    • Smart phone,MID;
    • Next-generation mobile devices with multifunction such as adding color TV and digital movie cameras;
    • Flat-screen TVs, blue-ray disc recorders, set top box;
    • Blue-ray disc recorders,
    • Telecomm base stations,communications.
    • Personal multimedia devices,consumer Products.
    • Telecomm base stations.
    • Communications

    Specification:


    temDescription
    CategoryMolding Power Inductor
    Inductance10.68uH~10uH
    Current Rating (Amps)510A~3A
    Size / Dimension5.4*5.2*2.0mm
    Materialone-piece alloy powder

    Dimensions

    Specification


    Packaging Information:

    NOTES:

    • DC current (Idc) that will cause an approximate △T of 40℃
    • DC current (Isat) that will cause Lo to drop approximately 20%
    • All test data is referenced to 25℃ ambient
    • Operating Temperature Range -55℃ to +120℃
    • The part temperature (ambient + temp rise) should not exceed 120℃ under the worst operating conditions.
    • Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions
    • all affect the part temperature. Part temperature should be verified in the end application.

    Packaging Quantity(pcs)


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