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0.2uH 4A Molding Power Inductor , Smd Power Choke For Computers

    Buy cheap 0.2uH 4A Molding Power Inductor , Smd Power Choke For Computers from wholesalers
     
    Buy cheap 0.2uH 4A Molding Power Inductor , Smd Power Choke For Computers from wholesalers
    • Buy cheap 0.2uH 4A Molding Power Inductor , Smd Power Choke For Computers from wholesalers
    • Buy cheap 0.2uH 4A Molding Power Inductor , Smd Power Choke For Computers from wholesalers

    0.2uH 4A Molding Power Inductor , Smd Power Choke For Computers

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    Brand Name : Forewell
    Model Number : CMLO0620H
    Certification : ISO9001,ISO14001
    Price : Negotiate
    Payment Terms : T/T
    Supply Ability : 1000000 pcs per lot
    Delivery Time : 3-21days
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    0.2uH 4A Molding Power Inductor , Smd Power Choke For Computers


    SMD Power Inductor Original Smd Alloy Powder Molded Chip Integrated Circuit Ic 1.0uH~4.7uH


    Features:

    • Magnetically shielded construction, low DC resistance;
    • Frequency Range: up to 29MHz;
    • RoHS compliant
    • Reliable quality

    Applications:

    • Smart phone,MID;
    • Next-generation mobile devices with multifunction such as adding color TV and digital movie cameras;
    • Flat-screen TVs, blue-ray disc recorders, set top box;
    • Notebooks, desktop computers, servers, graphic cards;
    • Automotive systems;

    Specification:


    temDescription
    CategoryMolding Power Inductor
    Inductance0.2uH~10uH
    Current Rating (Amps)530A~4A
    Size / Dimension7.1*6.6*2.0mm
    Materialone-piece alloy powder

    Dimensions

    Specification


    Packaging Information:

    NOTES:

    • DC current (Idc) that will cause an approximate △T of 40℃
    • DC current (Isat) that will cause Lo to drop approximately 20%
    • All test data is referenced to 25℃ ambient
    • Operating Temperature Range -55℃ to +120℃
    • The part temperature (ambient + temp rise) should not exceed 120℃ under the worst operating conditions.
    • Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions
    • all affect the part temperature. Part temperature should be verified in the end application.

    Packaging Quantity(pcs)



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