UNS C17200 BERYLLIUM COPPER PLATE SIZE 505 MM X 505 MM X 28 MM
SOLID COPPER SHEET
Product Normal Description:
Product Name: Berylliium copper plate
Standard: UNS C17200
Product Size: 505mm x 505mm x 28mm
State: TF00
Product Brand: CUBERYLLIUM®
We are supplying Beryllium Copper Plates to various sectors and
meeting their expectations. We are serving plates to electrical
industries to use in connectors, fuse clips contact bridges,
Electrical Switch and relay blades, spring connectors, switch
parts, navigational instruments, relay parts, washers etc. We are
also providing plates to different fasteners like lock washers,
retaining rings, Washers, roll pins, screws, and bolts. Our
Beryllium Copper plates are also provided to use in welding
equipment, Pumps, springs, electrochemical, shafts, bushings,
non-sparking safety tools, flexible metal hose, housings for
instruments, bearings, valve seats, valve stems, diaphragms,
springs, rolling mill parts, spline shafts, pump parts, and bourdon
tubes.
Chemical Composition of UNS C17200 BERYLLIUM COPPER ALLOY:
Product Grade: CUBERYLLIUM ®-172(UNS. C17200)
| Numbering | Be | Co+Ni | Cu | Fe | Pb | Si | Al |
| C17200 | 1.8-2.0 | ≥0.2 | Margin | 0.15 | - | 0.15 | 0.15 |
Note: Copper plus additions equal 99.5% Minimum.
Standard Specificaiton For UNS C17200 BERYLLIUM COPPER PLATE:
| Standards | ASTM B194 |
| Grade | Alloy 25 (C17200), CDA 172 |
| Specifications | AMS 4530, AMS 4533, AMS 4534, AMS 4650, AMS 4651, SAE J461, SAE
J463, JIS H 3130, RWMA Class 4 |
| Temper | A(TB00),H(TD04),AT(TF00),HT(TH04) |
Typical Physical Properties of UNS C17200 BERYLLIUM COPPER ALLOY:
| Density (g/cm3): | 8.36 |
| Density before age hardening (g/cm3): | 8.25 |
| Elastic Modulus (kg/mm2 (103)): | 13.4 |
| Thermal Expansion Coefficient (20 °C to 200 °C m/m/°C): | 17 x 10-6 |
| Thermal Conductivity (cal/(cm-s-°C)): | 0.25 |
| Melting Range (°C): | 870-980 |
Temper Designations of UNS C17200 BERYLLIUM COPPER PLATE:
| Mechanical and Electrical Properties of C17200 Sheet/Plate |
| CUBERYLLIUM | ASTM | Heat Treatment | Thickness (mm) | Tensile Strength (Mpa) | Elongation Percent | HARDNESS Rockwell B or C Scale | Electrical Conductivity
(% IACS) |
| Designation | Designation |
| A | TB00 | | All Size | 400~580 | 20~60 | B45-85 | 15～19 |
| H | TD04 | ＜10 | 600~880 | 8~20 | B91-103 | 15～19 |
| 10~25 | 600~850 | 8~20 | B90-102 | 15 ~ 19 |
| 25~50 | 580~820 | 8~20 | B88-102 | 15 ~19 |
| ＞50 | 580~820 | 8~20 | B88-102 | 15 ~19 |
| AT | TF00 |
3 hr 315℃
| All Size | 1120~1358 | 3~10 | C36-41 | 22 ~ 28 |
| HT | TH04 | 2 hr 315℃ | ＜10 | 1200~1450 | 1~5 | C38-45 | 22 ~ 28 |
| 10~25 | 1200~1500 | 1~5 | C38-44 | 22 ~ 28 |
| 25~50 | 1200~1450 | 2~5 | C37-43 | 22 ~ 28 |
| ＞50 | 1100~1350 | 2~5 | C36-42 | 22 ~ 28 |
Product Photos:
Key Technology of Beryllium Copper(Heat treatment)
Age Hardening
Age hardening significantly enhances the material’s strength. This
reaction is generally carried out at temperatures between 260°C and
540°C depending on alloy and desired characteristics. This cycle
causes the dissolved beryllium to precipitate as a beryllium rich
(gamma) phase in the matrix and at the grain boundaries. It is the
formation of this precipitate which causes the large increase in
material strength. The level of mechanical properties attained is
determined by the temperature and time at temperature. It should be
recognized that beryllium copper has no room temperature aging
characteristics.
