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Computers and peripherals Thermal Conductive Filler

    Buy cheap Computers and peripherals Thermal Conductive Filler from wholesalers
     
    Buy cheap Computers and peripherals Thermal Conductive Filler from wholesalers
    • Buy cheap Computers and peripherals Thermal Conductive Filler from wholesalers
    • Buy cheap Computers and peripherals Thermal Conductive Filler from wholesalers

    Computers and peripherals Thermal Conductive Filler

    Ask Lasest Price
    Brand Name : AOK
    Model Number : TF300
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15working days
    • Product Details
    • Company Profile

    Computers and peripherals Thermal Conductive Filler

    Cpu Light Blue Liquid Gap Filler Cooling Silicone Thermal Paste


    AttributeValueTest Method
    CompositionCeramic filler + Silicone-
    Color/Component AWhiteVisual
    Color/Component BLight BuleVisual
    Density(g/cc)3ASTM D792
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)≥7.0ASTM D149
    Dielectric Constant(@10mhz)7.3ASTM D150
    Volume Resistivity(Ω.cm)1.0*1013ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)3.0ASTM D5470
    Viscosity/Component A (cps)400000ASTM D2196
    Viscosity/Component B (cps)400000ASTM D2196
    Hradness,after cure(shore OO)40ASTM D22240

    Purchase information
    Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)


    Directions for use
    • Working hours @ 25C : 1 hour
    • Dry to touch @ 25C : 1 hour
    • Full cure @ 25C : 12-16 hours
    • Full cure @ 100C : 1 hour


    Storage & Shelf life
    Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.


    TF Series Thermal Conductive Gap Filler are two-part, 1:1 ratio, ceramic filled silicone dispensable gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high tolerances are present and designs require reduced mechanical stresses. Graphene reinforced single component precuring heat conducting gel is applied to all kinds of components with low stress
    requirement to make the products have high reliability. The product is self-adhesive and easily assembled. Meanwhile, customers
    can automatically dispense glue according to their own process to improve production efficiency.


    Product feature


    ■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
    ■ Room temperature cure
    ■ Highly compliant
    ■ Low pressure vs. deflection
    ■ High volume applications

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