High Cleanliness Waffle Pack Chip Tray For Small Bare Die
Waffle pack is widely used in semiconductor, photoelectric industry
customers of the product requires a high degree of cleanliness and
size, we from the design drawings, mold manufacturing, product
manufacturing to cleaning packing and so on, all of the steps and
operations through strict quality control, to deliver the ultimate
goal of customer satisfaction for product, continuously meet the
customer's requirements, To promote our factory to a higher level
of progress.
The HN21076 Waffle Pack Opening Procedure
1. Holding the clip with one hand, use the thumb of one hand and
thumb and fingers of the other hand to slide the waffle “tray" and
the lid out of the clip without allowing the tray and lid to
separate. JTI recommends using gloves when opening discrete device
packaging.
2. Carefully slide the tray and lid onto a flat surface without
allowing the tray and lid to separate. The work area should have
static reduction measures in place such as a grounded, dissipative
work surface and ionizing fans. It should be free of strong drafts,
particularly for parts smaller than 20 mil X20 mil (0.5 X0.5mm).
3. Hold down two diagonal corners with one hand to keep the lid
securely on top of the tray and use tweezers or another small tool
to gently tap the lid at the two exposed corners and the center of
the lid. This should cause any parts that may be stuck to the
insert to fall back into the cavity.
4. Carefully lift the lid straight up to remove from the tray, turn
the lid upside down and place it on the flat surface next to the
tray.
Outline Line Size | 101.6*101.6*4.5mm | Brand | Hiner-pack |
Model | HN21076 | Standard | ROHS,ISO9001 |
Cavity Size | 14*3.32*0.3mm | Matrix QTY | 17*4=68PCS |
Material | PC | Flatness | MAX 0.2mm |
Color | Black | Service | Accept OEM,ODM |
Resistance | 1.0x10e4-1.0x10e11Ω | Origin | China |
Advantage
1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe,
Korea, Japan...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.
Outline Size | Material | Surface Resistance | Service | Flatness | Color |
2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
Provide professional design and packaging for your products |
Product Application Of Chip Tray
Electronic component Semiconductor
Embedded System Display technology
FAQ
Q1. Do your products get any certificates?
Ans: Yes, CE for EU market, FDA for USA market.
Q2.Can you do the design for us?
Ans:Yes.,we have a professional team having rich experience in
designing and manufacturing. Just tell us your ideas and we will
help to carry out your ideas into perfect fact. It does not matter
if you do not have some one to complete files. Send us high
resolution images, your logo and text and tell us how you would
like to arrange them. We will send you finished files for
confirmation.
Q3. How long is the delivery time?
Ans:For standard machine, it would be 5-7Working days. For
non-standard/customized machines according to clients' specific
requirements, It would be 20~25 working days.
Q4. Do you arrange shipment for the products?
Ans:It’s depends on our incoterms,If FOB or CIF price, we will
arrange shipment for you, but EXW price, clients need to arrange
shipment by themselves or their agents.
Q5. How about the documents after shipment?
Ans:After shipment, we'll send all original documents to you by
DHL, including Commercial Invoice, Packing List, B/L and other
certificates as required by clients.
