Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board
(Printed circuits boards are custom-made products, the picture and
parameters shown are just for reference)
1.1 General description
This is a type of multilayer PCB built on FR-4 substrate with Tg
150°C for the application of mobile phone with blind via
technology. It's 1.6 mm thick with white silkscreen(Taiyo) on green
solder mask (Taiyo) and immersion gold on pads. The base material
is from ITEQ supplying single up PCB. They're fabricated per IPC
6012 Class 2 using supplied Gerber data. Each 25 boards are packed
for shipment.
1.2 Features and Benefits
1.2.1 Middle Tg FR-4 Shows low Z-CTE and excellent through hole
reliability;
1.2.2 Immersion gold has high solderability, no stressing and less
contamination;
1.2.3 Multilayer shortened connection between electronic
components;
1.2.4 16000㎡ workshop and 8000 types of PCB's per month;
1.2.5 Delivery on time: >98%
1.2.6 No minimum order quantity. 1 piece is available;
1.3 Applications
Industrial Computer
GPS Tracking System
POS Cash Register
Embedded Systems
Data Acquisition System
Microcontrollers
PC and Notebook
1.4 Parameter and data sheet
| PCB SIZE | 119 x 80mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 4 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Core FR-4 0.61mm |
| copper ------- 35um(1oz) MidLayer 1 |
| Prepreg 0.254mm |
| copper ------- 35um(1oz) MidLayer 2 |
| Core FR-4 0.61mm |
| copper ------- 18um(0.5oz)+plate BOT layer |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.3 mm /3.5 mm |
| Number of Different Holes: | 9 |
| Number of Drill Holes: | 415 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 Tg150℃, er<5.4.IT-158, ITEQ |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, stamp holes. |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.3mm. Blind Via Top to
Inner layer 1, Bottom to Inner layer 2 |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 Composition of Holes
The blind hole is located on the top and bottom surface of the
printed circuit board and has a certain depth for the connection
between the surface line and the inner line below. The depth of the
hole usually does not exceed a certain ratio (aperture). Buried
hole is a connecting hole located in the inner layer of the printed
circuit board, which does not extend to the surface of the circuit
board.
The above two kinds of holes are located in the inner layer of the
circuit board. The formation of through hole process is used before
lamination, and several inner layers may be overlapped done during
the formation of the through hole.
The third is called a through hole, which passes through the entire
circuit board. It can be used to interconnect internally or as an
installation location hole for components. Because the through hole
is easier to realize and the cost is low, it is used in most
printed circuit boards instead of the other two. The following
mentioned holes, without special instructions, are considered as
through holes.
From the design point of view, a hole is mainly composed of two
parts, one is the middle hole (drill hole), the other is the pad
area around the hole, see below. The size of these two parts
determines the size of the hole. Clearly, in
high-speed, high-density PCB design, designers always want the
holes the smaller the better, so that it can leave more wiring
space on the board.
1.6 PCB capability 2022
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006,
RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870,
RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10,
Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10,
TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B
(DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0,
DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000,
N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A
etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
