Hybrid PCB | Mixed Material 4-layer PCB Made On 20 mil RO4350B +
FR4 With Blind Via
(Printed circuit boards are custom-made products, the picture and
parameters shown are just for reference)
Hello everyone,
Continued with last article, today we’re going to talk about the
20mil RO4350B and FR-4 mixed.
Most of the situations are that the high frequency material plays
the role of signal transmission. Let’s see the stack-up.
Layer 1 to layer 2 is the core of 20mil (0.508mm) RO4350B high
frequency material, the signal transmission lines are on first
layer copper, then layer 3 to layer 4 is another core of epoxy
glass material. The 2 cores are bonded by a sheet of adhesive
(prepreg).
Basic specifications
Base material: RO4350B 0.508 mm + FR4 0.6mm + PP 0.306mm
Layer count: 4 layers
Panel: 75mm x 82mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 70 um/ Inner layer 35 um
Solder mask / Legend: green / white
Final PCB height: 1.6 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
1) The temperature coefficient of dielectric constant is among the
lowest of any circuit board material, making it ideal for
temperature sensitive applications;
2) RO4350B exhibits a stable dielectric constant over a broad
frequency range. This makes it an ideal substrate for broadband
applications;
3) Signal integrity performance improvement over the stack-ups with
all FR4 board;
4) ISO9001, ISO14001, IATF16949, UL Certified factory
5) Prototype to mass production capability;
Applications
Mixer, Radar data acquisition converter, Spread spectrum, Duplexer
Parameter and Data Sheet
