The design of the structure and shape in line with JEDEC
international standards can also perfectly meet the requirements of
the carriing components or IC of the tray, carriing function to
meet the requirements of the automatic feeding system, to achieve
the modernization of loading, improve work efficiency.
Providing a variety of packaging IC design solutions based on your
chip, the 100% custom tray is not only suitable for storing IC but
also better protect the chip storage.We have designed a lot of
packaging way, which also contains common BGA, FBGA, LGAQFN, QFP,
PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for
all packaging methods of chip tray.
Product Application
Package IC PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized |
| Outline Line Size | 323.09*136*10.6mm | Brand | Hiner-pack |
| Model | HN1984 | Package Type | PCBA |
| Cavity Size | 44*50*2.6mm | Matrix QTY | 2*4=8pcs |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost
effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply
with the international JEDEC standards, to ensure 100% qualified
rate.
